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This device is an ultra-miniature balun. The BALF-SPI2-01D3 integrates matching network and harmonics filter. Matching impedance has been customized for the ST S2-LP transceiver. The BALF-SPI2-01D3 uses STMicroelectronics IPD technology on non-conductive glass substrate which optimize RF performance.
Key Features
- 50 Ω nominal input / conjugate matched to ST S2-LP for 860 - 930 MHz frequency operation
- Low insertion loss
- Low amplitude imbalance
- Low phase imbalance
- Small footprint
- Very low profile < 620 μm after reflow
- High RF performance
- RF BOM and area reduction
- ECOPACK®2 compliant component
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Ecosystems
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Picture Part number Manufacturer Description SIGFOX-MOD1-C / -E XoverIoT The SIGFOX-MOD1 are ultra-low-power modules designed especially for sensor node applications mounted with chip antenna. SIGFOX-MOD2-C / -E XoverIoT The SIGFOX-MOD2 are ultra-low-power Uplink-Only modules designed especially for sensor node applications using Sigfox, subGHz and proprietary protocols. Part NumberThe SIGFOX-MOD1 are ultra-low-power modules designed especially for sensor node applications mounted with chip antenna.
The SIGFOX-MOD2 are ultra-low-power Uplink-Only modules designed especially for sensor node applications using Sigfox, subGHz and proprietary protocols.
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Picture Part number Manufacturer Description 
X-NUCLEO-S2868A1 ST Sub-1 GHz 868 MHz RF expansion board based on S2-LP radio for STM32 Nucleo Part NumberSub-1 GHz 868 MHz RF expansion board based on S2-LP radio for STM32 Nucleo
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Support and Applications
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|---|
| BALF-SPI2-01D3 | Active | Chip Scale Package 0.4mm pitch | Industrial | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Order from Distributors | Order from ST | Package | Packing Type | Minimum Sellable Quantity | Marketing Status | ECCN (US) | Country of Origin | Budgetary Price (US$)*/Qty | |
|---|---|---|---|---|---|---|---|---|---|---|
| BALF-SPI2-01D3 | 5 distributors | Buy now | Chip Scale Package 0.4mm pitch | Tape And Reel | 5000 | Active | EAR99 | FRANCE |
(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
