Search
Cancel
Search History
Bookmark

Please log in  to show your saved searches.

BALF-SPI2-01D3

Active
Save to myST

50 Ω nominal input / conjugate match balun to S2-LP,868 - 930 MHz with integrated harmonic filter

Download datasheet
Overview
Online design
Sample & Buy
Solutions
Documentation
CAD Resources
Tools & Software
Quality & Reliability
Partner products
Sales Briefcase

Product overview

Description

This device is an ultra-miniature balun. The BALF-SPI2-01D3 integrates matching network and harmonics filter. Matching impedance has been customized for the ST S2-LP transceiver. The BALF-SPI2-01D3 uses STMicroelectronics IPD technology on non-conductive glass substrate which optimize RF performance.

  • All features

    • 50 Ω nominal input / conjugate matched to ST S2-LP for 860 - 930 MHz frequency operation
    • Low insertion loss
    • Low amplitude imbalance
    • Low phase imbalance
    • Small footprint
    • Very low profile < 620 μm after reflow
    • High RF performance
    • RF BOM and area reduction
    • ECOPACK®2 compliant component
    Read more Read less

You might also like...

S2-LP

Ultra-low power, high performance, sub-1GHz transceiver

X-NUCLEO-S2868A1

Sub-1 GHz 868 MHz RF expansion board based on S2-LP radio for STM32 Nucleo

XoverIoT Sigfox SW Stack and AT-commands

Sigfox SW Stack and AT-commands.

Recommended for you

Related Products

Wireless Connectivity

Related Applications

Communications Equipment, Computers and Peripherals

Functions

Industrial

Personal Electronics

All tools & software

    • Part number
      		Status
      		Description
      		Type
      		Supplier

      SIGFOX-MOD1-C / -E

      Active

      The SIGFOX-MOD1 are ultra-low-power modules designed especially for sensor node applications mounted with chip antenna.

      		 Components and Modules XoverIoT
      SIGFOX-MOD1-C / -E

      Description:

      The SIGFOX-MOD1 are ultra-low-power modules designed especially for sensor node applications mounted with chip antenna.

      SIGFOX-MOD2-C / -E

      Active

      The SIGFOX-MOD2 are ultra-low-power Uplink-Only modules designed especially for sensor node applications using Sigfox, subGHz and proprietary protocols.

      		 Components and Modules XoverIoT
      SIGFOX-MOD2-C / -E

      Description:

      The SIGFOX-MOD2 are ultra-low-power Uplink-Only modules designed especially for sensor node applications using Sigfox, subGHz and proprietary protocols.
    • Part number
      		Status
      		Description
      		Type
      		Supplier

      SIGFOX-USB2-C

      Active

      USB Kickstart-Development Kit. The SIGFOX-USB2 is a baseboard with a SIGFOX-DEV1-C monted on it.

      		 Development Tool Hardware from Partners XoverIoT
      SIGFOX-USB2-C

      Description:

      USB Kickstart-Development Kit. The SIGFOX-USB2 is a baseboard with a SIGFOX-DEV1-C monted on it.
    • Part number
      		Status
      		Description
      		Type
      		Supplier

      X-NUCLEO-S2868A1

      NRND

      Sub-1 GHz 868 MHz RF expansion board based on S2-LP radio for STM32 Nucleo

      		 STM32 ODE Connect HW ST
      X-NUCLEO-S2868A1

      Description:

      Sub-1 GHz 868 MHz RF expansion board based on S2-LP radio for STM32 Nucleo
    • Part number
      		Status
      		Description
      		Type
      		Supplier

      Training on antennas for Sigfox and subGHz

      Active

      The training gives a quick and substantial introduction into the features of frequently used antennas, their characteristics and their peculiarities.

      		 Trainings XoverIoT
      Training on antennas for Sigfox and subGHz

      Description:

      The training gives a quick and substantial introduction into the features of frequently used antennas, their characteristics and their peculiarities.

All resources

Expand all categories
Resource title
Version
Latest update

Product Specifications (1)

Resource title
Version
Latest update
DS12249 50 Ω nominal input / conjugate matched balun to ST S2-LP, 860-930 MHz with integrated harmonic filter
2.1 20 Mar 2018
20 Mar 2018
DS12249 50 Ω nominal input / conjugate matched balun to ST S2-LP, 860-930 MHz with integrated harmonic filter 2.1

Application Notes (3)

Resource title
Version
Latest update
AN4315 BAL-NRF02D3 matched balun with integrated harmonics filter for Nordic Semiconductor chips with ultralow power transceivers
2.2 13 Sep 2018
13 Sep 2018
AN4315 BAL-NRF02D3 matched balun with integrated harmonics filter for Nordic Semiconductor chips with ultralow power transceivers 2.2
AN2348 IPAD™ 400 µm Flip Chip: package description and recommendations for use
5.0 13 Sep 2018
13 Sep 2018
AN2348 IPAD™ 400 µm Flip Chip: package description and recommendations for use 5.0
AN1235 IPAD™ 500 µm Flip Chip: package description and recommendations for use
8.0 22 Sep 2015
22 Sep 2015
AN1235 IPAD™ 500 µm Flip Chip: package description and recommendations for use 8.0

Technical Notes & Articles (1)

Resource title
Version
Latest update
TN1173 Packing information for IPAD, protection, rectifiers, thyristors and AC Switches
9.0 24 May 2021
24 May 2021
TN1173 Packing information for IPAD, protection, rectifiers, thyristors and AC Switches 9.0

Flyers (2)

Resource title
Version
Latest update
TINIEST MATCHED BALUNS for WiFi, Bluetooth & Sub-GHz
1.0 05 Nov 2020
05 Nov 2020
TINIEST MATCHED BALUNS for WiFi, Bluetooth & Sub-GHz 1.0
Tiniest Matched Baluns for Wifi, Bluetooth & Sub-GHz
1.0 25 Feb 2020
25 Feb 2020
Tiniest Matched Baluns for Wifi, Bluetooth & Sub-GHz 1.0

Brochures (2)

Resource title
Version
Latest update
Products and solutions for Smart industry
04.21 30 Apr 2021
30 Apr 2021
Products and solutions for Smart industry 04.21
Semiconductor solutions for healthcare applications
1.0 19 Sep 2019
19 Sep 2019
Semiconductor solutions for healthcare applications 1.0

EDA Symbols, Footprints and 3D Models

STMicroelectronics - BALF-SPI2-01D3

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

Symbols

Symbols

Footprints

Footprints

3D model

3D models

All resources

Expand all categories
Resource title
Version
Latest update

CAD Symbol & Footprint models (2)

Resource title
Version
Latest update
balf-spi2-01d3 Altium Symbol and Footprint files
1.0 08 Jun 2021
08 Jun 2021
balf-spi2-01d3 Altium Symbol and Footprint files 1.0
balf-spi2-01d3 OrCad Symbol and Footprint files
1.0 07 Jun 2021
07 Jun 2021
balf-spi2-01d3 OrCad Symbol and Footprint files 1.0

Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
BALF-SPI2-01D3
Active
Chip Scale Package 0.4mm pitch Industrial Ecopack2

BALF-SPI2-01D3

Package:

Chip Scale Package 0.4mm pitch

Material Declaration**:

PDF XML
More Info

Marketing Status

Active

Package

Chip Scale Package 0.4mm pitch

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

Part Number
Order from Distributors
Order from ST
Marketing Status
ECCN (US)
ECCN (EU)
Packing Type
Package
Temperature (°C) Minimum Sellable Quantity
Budgetary Price (US$)*/Qty
More info
min
max
BALF-SPI2-01D3 Available at 1 distributors

Distributor availability ofBALF-SPI2-01D3

Distributor Name
Region Stock Min. Order Third party link
Farnell Element14 EUROPE 4806 1 Order Now

Distributor reported inventory date: 2021-07-29

Distributor Name

Farnell Element14

Stock

4806

Min.Order

1

Region

EUROPE Order Now

Distributor reported inventory date: 2021-07-29

Active
EAR99 NEC Tape And Reel Chip Scale Package 0.4mm pitch - - 5000 0.19 / 500
MORE INFO

Unit Price (US$):

0.19

Country of Origin:

FRANCE

BALF-SPI2-01D3

Marketing Status

Active

ECCN (US)

EAR99
More Info

Budgetary Price (US$)*/Qty

0.19 / 500

Distributor availability ofBALF-SPI2-01D3

Distributor Name
Region Stock Min. Order Third party link
Farnell Element14 EUROPE 4806 1 Order Now

Distributor reported inventory date: 2021-07-29

Distributor Name

Farnell Element14

Stock

4806

Min.Order

1

Region

EUROPE Order Now

Distributor reported inventory date: 2021-07-29

ECCN (EU)

NEC

Packing Type

Tape And Reel

Package

Chip Scale Package 0.4mm pitch

Operating Temperature (°C)

(min)

-

(max)

-

Minimum Sellable Quantity

5000

Budgetary Price (US$)* / Qty

0.19 / 500

Country of Origin

FRANCE

(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

  • Newsletter Sign Up

Follow Us

All rights reserved © 2021 STMicroelectronics |
Terms of use | Sales Terms & Conditions | Trademarks | Privacy Portal | Manage Cookies

Did you know?

Please provide email

Please enter code

Congratulations!

Simple subscription

Congratulations!

x

You can start following this product to receive updates when new Resources, Tools and SW become available. It's easy and takes only 1 minute.

You can start following this product to receive updates when new Resources, Tools and SW become available. It's easy and takes only 1 minute.

You can start following this product to receive updates when new Resources, Tools and SW become available. It's easy and takes only 1 minute.

Invalid code, please check the code sent to your email address and validate again. In case you did not receive any code please select 'I did not receive code'

You can start following this product to receive updates when new Resources, Tools and SW become available. It's easy and takes only 1 minute.

ST (as data controller according to the Privacy Policy) will keep a record of my navigation history and use that information as well as the personal data that I have communicated to ST for marketing purposes relevant to my interests. My personal data will be provided to ST affiliates and distributors of ST in countries located in the European Union and outside of the European Union for the same marketing purposes 

---------
I understand that I can withdraw my consent at any time through opt-out links embedded in communication I receive or by managing my account settings. I can also exercise other user’s rights at any time as described in the Privacy Policy.

ST will retain your browsing history and use details of the products and services that you have previously accessed, purchased or downloaded to make suggestions to you for other products and services which ST believe you will also be interested in.
ST uses the personal data that you provide directly to it and through your activity on ST websites in accordance with the Privacy Policy, to send you (directly or via ST local affiliates or distributors) newsletters, advertisements or other specific and targeted marketing material about ST products and services. Your personal data will be provided to ST local affiliates and distributors in countries located in the European Union and outside of the European Union. You can consult the list of ST local affiliates and distributors in our website’s Privacy Policy. To send you specific and targeted marketing material, the information that you provide directly to ST and/or through your activity on ST websites may also be combined with other information that ST obtains from you in another context (e.g. if you enter into a business relationship with ST, its local affiliates or distributors).

You are now subscribed to
- BALF-SPI2-01D3

You can re-use the validation code to subscribe to another product or application.

Sorry, there was a problem on our servers. Please try again.