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  • The CPL-WBF-00D3 is a low band coupler designed to measure RF antenna output power in GSM / WCDMA / TD-SCDMA / LTE applications. This coupler has been customized for wide band operating frequencies (EGSM, CELL, PCS, DCS, TD-SCDMA, WCDMA and LTE) with less than 0.30 dB insertion losses in the bandwidth (698 MHz to 2700 MHz).

    The CPL-WBF-00D3 has been designed using STMicroelectronics IPD (integrated passive device) technology on non-conductive glass substrate to optimize RF performance. The device is delivered 100% tested, in tape and reel.

    Key Features

    • 50 Ω nominal input / output impedance
    • Wide operating frequency range (698 MHz to 2700 MHz)
    • Low insertion loss
    • 30 dB coupling factor with high flatness
    • High directivity
    • High ESD robustness (IEC 61000-4-2 level 4)
    • Flip Chip package
    • Small footprint

Sample & Buy

Part Number
Package
Packing Type
Minimum Sellable Quantity
Marketing Status
Budgetary Price (US$)*
Quantity
ECCN (US)
Country of Origin
Order from Distributors
Order from ST
CPL-WBF-00D3 Chip Scale Package 0.4mm pitch Tape And Reel 5000
Active
0.2 100 EAR99 CHINA No availability of distributors reported, please contact our sales office Buy now

CPL-WBF-00D3

Package

Chip Scale Package 0.4mm pitch

Packing Type

Tape And Reel

Unit Price (US$)

0.2*

Minimum Sellable Quantity

5000

Marketing Status

Active

Unit Price (US$)

0.2

Quantity

100

ECCN (US)

EAR99

Country of Origin

CHINA

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

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00 Files selected for download

Technical Documentation

    • Description Version Size Action
      DS9150
      Wide band directional coupler with ISO port
      3.0
      793.7 KB
      PDF
      DS9150

      Wide band directional coupler with ISO port

    • Description Version Size Action
      AN2348
      IPAD™ 400 µm Flip Chip: package description and recommendations for use
      5.0
      261.7 KB
      PDF
      AN1235
      IPAD™ 500 µm Flip Chip: package description and recommendations for use
      8.0
      251.82 KB
      PDF
      AN2348

      IPAD™ 400 µm Flip Chip: package description and recommendations for use

      AN1235

      IPAD™ 500 µm Flip Chip: package description and recommendations for use

    • Description Version Size Action
      TN1173
      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches
      6.0
      444.57 KB
      PDF
      TN1173

      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches

HW Model, CAD Libraries & SVD

    • Description Version Size Action
      Wide band directional coupler with ISO port 1.0
      12.68 KB
      ZIP

      Wide band directional coupler with ISO port

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
CPL-WBF-00D3
Active
Chip Scale Package 0.4mm pitch Industrial Ecopack2

CPL-WBF-00D3

Package:

Chip Scale Package 0.4mm pitch

Material Declaration**:

PDF XML

Marketing Status

Active

Package

Chip Scale Package 0.4mm pitch

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.