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  • The EMIF01-1008AF4 is a highly integrated device designed as a low-pass filter that rejects frequencies in the 600 MHz to 1.55 GHz band.

    It also incorporates a bidirectional 5.5 V ESD protection to protect the system against electrostatic discharges up to 15 kV.

    Key Features

    • Low clamping voltage
    • Bidirectional ESD protection
    • Stand-off voltage of 5.5 V
    • Excellent rejection levels: < -30 dB from 600 MHz to 1.55 GHz
    • 0201-3L package: 0.76 x 0.34 mm
    • Very thin package: 0.24 mm maximum
    • Resin coating on all 6 faces
    • Complies with IEC 61000-4-2 level 4 on pin 3:
      • ±15 kV (air discharge)
      • ±8 kV (contact discharge)
    • MIL STD 883G - Method 3015-7 on pin 1:
      • ±2 kV HBM (human body model)

Sample & Buy

Part Number
Package
Packing Type
Marketing Status
Budgetary Price (US$)*
Quantity
ECCN (US)
Country of Origin
Order from Distributors
Order from ST
EMIF01-1008AF4 CSPS BUMPLESS COATING Tape And Reel
Active
- - EAR99 - No availability of distributors reported, please contact our sales office

EMIF01-1008AF4

Package

CSPS BUMPLESS COATING

Packing Type

Tape And Reel

Unit Price (US$)

*

Marketing Status

Active

Unit Price (US$)

-

Quantity

-

ECCN (US)

EAR99

Country of Origin

-

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

Recommended for you

00 Files selected for download

Technical Documentation

    • Description Version Size Action
      DS12944
      Single-line low-pass filter and ESD protection
      1.0
      532.4 KB
      PDF
      DS12944

      Single-line low-pass filter and ESD protection

    • Description Version Size Action
      AN5241
      Fundamentals of ESD protection at system level
      1.1
      1.45 MB
      PDF
      AN3353
      IEC 61000-4-2 standard testing
      1.2
      171.08 KB
      PDF
      AN2348
      IPAD™ 400 µm Flip Chip: package description and recommendations for use
      5.0
      261.7 KB
      PDF
      AN1235
      IPAD™ 500 µm Flip Chip: package description and recommendations for use
      8.0
      251.82 KB
      PDF
      AN5241

      Fundamentals of ESD protection at system level

      AN3353

      IEC 61000-4-2 standard testing

      AN2348

      IPAD™ 400 µm Flip Chip: package description and recommendations for use

      AN1235

      IPAD™ 500 µm Flip Chip: package description and recommendations for use

    • Description Version Size Action
      TN1173
      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches
      6.0
      444.57 KB
      PDF
      TN1173

      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
EMIF01-1008AF4
Active
CSPS BUMPLESS COATING Industrial Ecopack2

EMIF01-1008AF4

Package:

CSPS BUMPLESS COATING

Material Declaration**:

PDF XML

Marketing Status

Active

Package

CSPS BUMPLESS COATING

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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