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The EMIF02-USB01F2 is a highly integrated array designed to suppress EMI / RFI noise for USB port filtering. The EMIF02-USB01F2 Flip-Chip packaging means the package size is equal to the die size.
Additionally, this filter includes ESD protection circuitry which prevents damage to the protected device when subjected to ESD surges up to 15 kV.
Key Features
- High reliability offered by monolithic integration
- High efficiency in ESD suppression (IEC 61000-4-2 level 4)
- Complies with the following standards
IEC 61000-4-2 level 4 ±15 kV (air discharge) ±8 kV (contact discharge) - 2-line low-pass filter + ESD protection
- Lead-free package
- High efficiency in EMI filtering
- Very thin package: 0.65 mm
- High reduction of parasitic elements through integration and wafer level packaging
- Very low PCB space occupation: < 2.5 mm2
Sample & Buy
| Part Number | Package | Packing Type | Marketing Status | Budgetary Price (US$)* | Quantity | ECCN (US) | Country of Origin | Order from Distributors | Order from ST |
|---|---|---|---|---|---|---|---|---|---|
| EMIF02-USB01F2 | Chip Scale Package 0.5mm pitch | Tape And Reel |
Active
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0.343 | 1000 | EAR99 | CHINA | Check Availability | Buy now |
(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors
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| Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|---|
| EMIF02-USB01F2 |
Active
|
Chip Scale Package 0.5mm pitch | Industrial | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
