2-line EMI filter and ESD protection with R pull-up for USB interfaces

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  • The EMIF02-USB03F2 is a highly integrated array designed to suppress EMI / RFI noise for USB OTG (on-the-go) ports.

    The EMIF02-USB03F2 Flip-Chip packaging means the package size is equal to the die size.
    Additionally, this filter includes ESD protection circuitry which prevents damage to the protected device when subjected to ESD surges up to 15 kV on external contacts.

    Key Features

    • 2-line, low-pass filter + 2-line ESD protection
    • High efficiency in EMI filtering
    • Lead-free package
    • Very low PCB space occupation: < 2.80 mm
    • Very thin package: 0.65 mm
    • High efficiency in ESD suppression (IEC 61000-4-2 level 4)
    • High reliability offered by monolithic integration
    • High reduction of parasitic elements through integration and wafer level packaging

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Part Number
Package
Packing Type
Marketing Status
Budgetary Price (US$)*
Quantity
ECCN (US)
Country of Origin
Order from Distributors
Order from ST
EMIF02-USB03F2 Chip Scale Package 0.5mm pitch Tape And Reel
Active
0.402 100 EAR99 CHINA Check Availability

Distributor availability ofEMIF02-USB03F2

Distributor Name
Region Stock Min. Order Third party link
DIGIKEY WORLDWIDE 1228 1 Order Now
RS COMPONENTS EUROPE 3950 1 Order Now
AVNET AMERICA 25000 0 Order Now
ARROW EUROPE 8302 0 Order Now
MOUSER WORLDWIDE 4815 1 Order Now
Farnell Element14 EUROPE 15056 1 Order Now
ANGLIA Live EUROPE 10000 1 Order Now

Distributor reported inventory date: 2019-09-15

Distributor Name

DIGIKEY

Stock

1228

Min.Order

1

Region

WORLDWIDE Order Now

RS COMPONENTS

Stock

3950

Min.Order

1

Region

EUROPE Order Now

AVNET

Stock

25000

Min.Order

0

Region

AMERICA Order Now

ARROW

Stock

8302

Min.Order

0

Region

EUROPE Order Now

MOUSER

Stock

4815

Min.Order

1

Region

WORLDWIDE Order Now

Farnell Element14

Stock

15056

Min.Order

1

Region

EUROPE Order Now

ANGLIA Live

Stock

10000

Min.Order

1

Region

EUROPE Order Now

Distributor reported inventory date: 2019-09-15

Get sample

EMIF02-USB03F2

Package

Chip Scale Package 0.5mm pitch

Packing Type

Tape And Reel

Unit Price (US$)

0.402*

Distributor availability ofEMIF02-USB03F2

Distributor Name
Region Stock Min. Order Third party link
DIGIKEY WORLDWIDE 1228 1 Order Now
RS COMPONENTS EUROPE 3950 1 Order Now
AVNET AMERICA 25000 0 Order Now
ARROW EUROPE 8302 0 Order Now
MOUSER WORLDWIDE 4815 1 Order Now
Farnell Element14 EUROPE 15056 1 Order Now
ANGLIA Live EUROPE 10000 1 Order Now

Distributor reported inventory date: 2019-09-15

Distributor Name

DIGIKEY

Stock

1228

Min.Order

1

Region

WORLDWIDE Order Now

RS COMPONENTS

Stock

3950

Min.Order

1

Region

EUROPE Order Now

AVNET

Stock

25000

Min.Order

0

Region

AMERICA Order Now

ARROW

Stock

8302

Min.Order

0

Region

EUROPE Order Now

MOUSER

Stock

4815

Min.Order

1

Region

WORLDWIDE Order Now

Farnell Element14

Stock

15056

Min.Order

1

Region

EUROPE Order Now

ANGLIA Live

Stock

10000

Min.Order

1

Region

EUROPE Order Now

Distributor reported inventory date: 2019-09-15

Marketing Status

Active

Unit Price (US$)

0.402

Quantity

100

ECCN (US)

EAR99

Country of Origin

CHINA

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

Recommended for you

00 Files selected for download

Technical Documentation

    • Description Version Size Action
      DS3988
      2-line IPAD™, EMI filter including ESD protection
      6.0
      241.81 KB
      PDF
      DS3988

      2-line IPAD™, EMI filter including ESD protection

    • Description Version Size Action
      AN5241
      Fundamentals of ESD protection at system level
      1.1
      1.45 MB
      PDF
      AN3353
      IEC 61000-4-2 standard testing
      1.2
      171.08 KB
      PDF
      AN2348
      IPAD™ 400 µm Flip Chip: package description and recommendations for use
      5.0
      261.7 KB
      PDF
      AN1235
      IPAD™ 500 µm Flip Chip: package description and recommendations for use
      8.0
      251.82 KB
      PDF
      AN5241

      Fundamentals of ESD protection at system level

      AN3353

      IEC 61000-4-2 standard testing

      AN2348

      IPAD™ 400 µm Flip Chip: package description and recommendations for use

      AN1235

      IPAD™ 500 µm Flip Chip: package description and recommendations for use

    • Description Version Size Action
      TN1173
      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches
      6.0
      444.57 KB
      PDF
      TN1173

      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches

HW Model, CAD Libraries & SVD

    • Description Version Size Action
      emif02-usb03f2 OrCad Symbol and Footprint files 1.0
      14.4 KB
      ZIP

      emif02-usb03f2 OrCad Symbol and Footprint files

Presentations & Training Material

    • Description Version Size Action
      USB 2.0 protection and IPAD™ solutions presentation 2.0
      707.4 KB
      PDF
      USB type-C Power Delivery advanced protection fundamentals 1.0
      396.47 KB
      PDF
      USB type-C™ advanced protection solutions quick start guide 2.0
      1.31 MB
      PDF
      USB type-C™ datalines and 'alternate mode' advanced protection fundamentals 1.0
      657.2 KB
      PDF

      USB 2.0 protection and IPAD™ solutions presentation

      USB type-C Power Delivery advanced protection fundamentals

      USB type-C™ advanced protection solutions quick start guide

      USB type-C™ datalines and 'alternate mode' advanced protection fundamentals

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
EMIF02-USB03F2
Active
Chip Scale Package 0.5mm pitch Industrial Ecopack2

EMIF02-USB03F2

Package:

Chip Scale Package 0.5mm pitch

Material Declaration**:

PDF XML

Marketing Status

Active

Package

Chip Scale Package 0.5mm pitch

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.