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  • The EMIF03-SIM05F3 is a highly integrated device designed to protect SIM interface and SWP line against ESD transients and EMI emission.

    The device is the ideal fit for applications using NFC.

    Key Features

    • Lead-free package
    • Very low PCB space consumption
    • Very thin package: < 0.55 mm after reflow
    • High efficiency in ESD suppression IEC6 1000-4-2 level 4
    • High reliability offered by monolithic integration
    • High reduction of parasitic elements through integration and WLCSP packaging
    • Complies with the following standards:
      • IEC 61000-4-2 level 4
        • ± 15 kV (air discharge)
        • ± 8 kV (contact discharge)

Sample & Buy

Part Number
Package
Packing Type
Marketing Status
Budgetary Price (US$)*
Quantity
ECCN (US)
Country of Origin
Order from Distributors
Order from ST
EMIF03-SIM05F3 Chip Scale Package 0.4mm pitch Tape And Reel
NRND
- - EAR99 - No availability of distributors reported, please contact our sales office

EMIF03-SIM05F3

Package

Chip Scale Package 0.4mm pitch

Packing Type

Tape And Reel

Unit Price (US$)

*

Marketing Status

NRND

Unit Price (US$)

-

Quantity

-

ECCN (US)

EAR99

Country of Origin

-

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

Recommended for you

00 Files selected for download

Technical Documentation

    • Description Version Size Action
      DS9085
      EMI filter with SWP protection for SIM interface
      1.0
      359.93 KB
      PDF
      DS9085

      EMI filter with SWP protection for SIM interface

    • Description Version Size Action
      AN4541
      EMI filters for SD3.0 card high-speed SD card protection and filtering devices
      1.1
      1.13 MB
      PDF
      AN5241
      Fundamentals of ESD protection at system level
      1.1
      1.45 MB
      PDF
      AN3353
      IEC 61000-4-2 standard testing
      1.2
      171.08 KB
      PDF
      AN2348
      IPAD™ 400 µm Flip Chip: package description and recommendations for use
      5.0
      261.7 KB
      PDF
      AN1235
      IPAD™ 500 µm Flip Chip: package description and recommendations for use
      8.0
      251.82 KB
      PDF
      AN4541

      EMI filters for SD3.0 card high-speed SD card protection and filtering devices

      AN5241

      Fundamentals of ESD protection at system level

      AN3353

      IEC 61000-4-2 standard testing

      AN2348

      IPAD™ 400 µm Flip Chip: package description and recommendations for use

      AN1235

      IPAD™ 500 µm Flip Chip: package description and recommendations for use

    • Description Version Size Action
      TN1173
      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches
      6.0
      444.57 KB
      PDF
      TN1173

      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches

HW Model, CAD Libraries & SVD

    • Description Version Size Action
      emif03-sim05f3 OrCad Symbol and Footprint files 1.0
      13.9 KB
      ZIP

      emif03-sim05f3 OrCad Symbol and Footprint files

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
EMIF03-SIM05F3
NRND
Chip Scale Package 0.4mm pitch Industrial Ecopack2

EMIF03-SIM05F3

Package:

Chip Scale Package 0.4mm pitch

Material Declaration**:

PDF XML

Marketing Status

NRND

Package

Chip Scale Package 0.4mm pitch

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.