EMIF04-EAR02M8

Active

2-line EMI filter for earphones + 2-line EMI filter for microphones

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  • The EMIF04-EAR02M8 chip is a highly integrated device designed to suppress EMI/RFI noise for mobile phone headsets. The new LC architecture on the speaker lines provides a high attenuation value maintaining a very low serial resistance.

    The μQFN-8L package offers the possibility to integrate the whole function in a very small PCB space.
    Additionally, this filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 30 kV.

    Key Features

    • lead-free package
    • high attenuation: -30 dB at 900 MHz
    • low cut-off frequencies: 60 MHz for speaker lines
    • high current capability: 50 mA per line
    • very low PCB space consumption: 1.5 mm x 1.7 mm
    • very thin package: 0.6 mm maximum
    • high efficiency in ESD suppression IEC6 1000-4-2 level 4
    • high reliability offered by monolithic integration
    • Complies with following standards:
      • IEC 61000-4-2 level 4 all pins:
        • 15 kV (air discharge)
        • 8 kV (contact discharge)

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Part Number
Package
Packing Type
Marketing Status
Budgetary Price (US$)*
Quantity
ECCN (US)
Country of Origin
Order from Distributors
Order from ST
EMIF04-EAR02M8 uQFN-8L Tape And Reel
Active
0.501 1000 EAR99 MALAYSIA Check Availability

Distributor availability ofEMIF04-EAR02M8

Distributor Name
Region Stock Min. Order Third party link
DIGIKEY WORLDWIDE 32399 1 Order Now
AVNET AMERICA 3000 0 Order Now
MOUSER WORLDWIDE 35154 1 Order Now
Farnell Element14 EUROPE 5875 1 Order Now

Distributor reported inventory date: 2019-12-12

Distributor Name

DIGIKEY

Stock

32399

Min.Order

1

Region

WORLDWIDE Order Now

AVNET

Stock

3000

Min.Order

0

Region

AMERICA Order Now

MOUSER

Stock

35154

Min.Order

1

Region

WORLDWIDE Order Now

Farnell Element14

Stock

5875

Min.Order

1

Region

EUROPE Order Now

Distributor reported inventory date: 2019-12-12

Buy now

EMIF04-EAR02M8

Package

uQFN-8L

Packing Type

Tape And Reel

Unit Price (US$)

0.501*

Distributor availability ofEMIF04-EAR02M8

Distributor Name
Region Stock Min. Order Third party link
DIGIKEY WORLDWIDE 32399 1 Order Now
AVNET AMERICA 3000 0 Order Now
MOUSER WORLDWIDE 35154 1 Order Now
Farnell Element14 EUROPE 5875 1 Order Now

Distributor reported inventory date: 2019-12-12

Distributor Name

DIGIKEY

Stock

32399

Min.Order

1

Region

WORLDWIDE Order Now

AVNET

Stock

3000

Min.Order

0

Region

AMERICA Order Now

MOUSER

Stock

35154

Min.Order

1

Region

WORLDWIDE Order Now

Farnell Element14

Stock

5875

Min.Order

1

Region

EUROPE Order Now

Distributor reported inventory date: 2019-12-12

Marketing Status

Active

Unit Price (US$)

0.501

Quantity

1000

ECCN (US)

EAR99

Country of Origin

MALAYSIA

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

Recommended for you

00 Files selected for download

Technical Documentation

    • Description Version Size Action
      DS6161
      4-line IPAD™ EMI filter and ESD protection for headset
      2.1
      431.03 KB
      PDF
      DS6161

      4-line IPAD™ EMI filter and ESD protection for headset

    • Description Version Size Action
      AN5241
      Fundamentals of ESD protection at system level
      1.1
      1.45 MB
      PDF
      AN5121
      HDMI ESD protection and signal conditioning products for STBs
      1.2
      2.44 MB
      PDF
      AN3353
      IEC 61000-4-2 standard testing
      1.2
      171.08 KB
      PDF
      AN2348
      IPAD™ 400 µm Flip Chip: package description and recommendations for use
      5.0
      261.7 KB
      PDF
      AN1235
      IPAD™ 500 µm Flip Chip: package description and recommendations for use
      8.0
      251.82 KB
      PDF
      AN5241

      Fundamentals of ESD protection at system level

      AN5121

      HDMI ESD protection and signal conditioning products for STBs

      AN3353

      IEC 61000-4-2 standard testing

      AN2348

      IPAD™ 400 µm Flip Chip: package description and recommendations for use

      AN1235

      IPAD™ 500 µm Flip Chip: package description and recommendations for use

    • Description Version Size Action
      TN1200
      Micro-bump Flip Chip: package description and recommendations for use
      1.0
      280.7 KB
      PDF
      TN1173
      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches
      6.0
      444.57 KB
      PDF
      TN1200

      Micro-bump Flip Chip: package description and recommendations for use

      TN1173

      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches

HW Model, CAD Libraries & SVD

    • Description Version Size Action
      emif04-ear02m8 OrCad Symbol and Footprint files 1.0
      15.58 KB
      ZIP

      emif04-ear02m8 OrCad Symbol and Footprint files

Publications and Collaterals

    • Description Version Size Action
      The ultimate HDMI control-link buffer 2.1
      478.94 KB
      PDF

      The ultimate HDMI control-link buffer

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
EMIF04-EAR02M8
Active
uQFN-8L Industrial Ecopack2

EMIF04-EAR02M8

Package:

uQFN-8L

Material Declaration**:

PDF XML

Marketing Status

Active

Package

uQFN-8L

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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