The EMIF06-HMC02F2 is a highly integrated array designed to suppress EMI / RFI noise for High Speed MultiMediaCard™ port filtering. The EMIF06-HMC02F2 Flip-Chip packaging means the package size is equal to the die size.
Additionally, this filter includes an ESD protection circuitry which prevents the protected device from destruction when subjected to ESD surges up to 15 kV. Compared to EMIF06-HMC01F2, the EMIF06-HMC02F2 has its ground balls connected together internally.
- 6 lines low-pass-filter
- High efficiency in EMI filtering
- Very low PCB space consuming: < 4 mm²
- Lead-free package
- Very thin package: 0.65 mm
- High efficiency in ESD suppression
- High reliability offered by monolithic integration
- High reducing of parasitic elements through integration and wafer level packaging
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|Part Number||Marketing Status||Package||Grade||RoHS Compliance Grade||Material Declaration**|
|Chip Scale Package 0.5mm pitch||Industrial||Ecopack2||
Package:Chip Scale Package 0.5mm pitch
Chip Scale Package 0.5mm pitch
RoHS Compliance Grade
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.