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  • The EMIF06-HMC02F2 is a highly integrated array designed to suppress EMI / RFI noise for High Speed MultiMediaCard™ port filtering. The EMIF06-HMC02F2 Flip-Chip packaging means the package size is equal to the die size.

    Additionally, this filter includes an ESD protection circuitry which prevents the protected device from destruction when subjected to ESD surges up to 15 kV. Compared to EMIF06-HMC01F2, the EMIF06-HMC02F2 has its ground balls connected together internally.

    Key Features

    • 6 lines low-pass-filter
    • High efficiency in EMI filtering
    • Very low PCB space consuming: < 4 mm²
    • Lead-free package
    • Very thin package: 0.65 mm
    • High efficiency in ESD suppression
    • High reliability offered by monolithic integration
    • High reducing of parasitic elements through integration and wafer level packaging

Recommended for you

00 Files selected for download

Technical Documentation

    • Description Version Size Action
      DS11483
      6-line IPAD™, EMI filter including ESD protection
      1.0
      280.11 KB
      PDF
      DS11483

      6-line IPAD™, EMI filter including ESD protection

    • Description Version Size Action
      AN4541
      EMI filters for SD3.0 card high-speed SD card protection and filtering devices
      1.1
      1.13 MB
      PDF
      AN5241
      Fundamentals of ESD protection at system level
      1.1
      1.45 MB
      PDF
      AN3353
      IEC 61000-4-2 standard testing
      1.2
      171.08 KB
      PDF
      AN2348
      IPAD™ 400 µm Flip Chip: package description and recommendations for use
      5.0
      261.7 KB
      PDF
      AN1235
      IPAD™ 500 µm Flip Chip: package description and recommendations for use
      8.0
      251.82 KB
      PDF
      AN4541

      EMI filters for SD3.0 card high-speed SD card protection and filtering devices

      AN5241

      Fundamentals of ESD protection at system level

      AN3353

      IEC 61000-4-2 standard testing

      AN2348

      IPAD™ 400 µm Flip Chip: package description and recommendations for use

      AN1235

      IPAD™ 500 µm Flip Chip: package description and recommendations for use

    • Description Version Size Action
      TN1173
      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches
      7.0
      433.12 KB
      PDF
      TN1173

      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches

HW Model, CAD Libraries & SVD

    • Description Version Size Action
      emif06-hmc02f2 Orcad Symbol and Footprint files 1.2
      16.67 KB
      ZIP

      emif06-hmc02f2 Orcad Symbol and Footprint files

Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
EMIF06-HMC02F2
Active
Chip Scale Package 0.5mm pitch Industrial Ecopack2

EMIF06-HMC02F2

Package:

Chip Scale Package 0.5mm pitch

Material Declaration**:

Marketing Status

Active

Package

Chip Scale Package 0.5mm pitch

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

Part Number
Order from Distributors
Order from ST
Package
Packing Type
Marketing Status
ECCN (US)
Country of Origin
Budgetary Price (US$)*/Qty
EMIF06-HMC02F2 No availability of distributors reported, please contact our sales office Buy now Chip Scale Package 0.5mm pitch Tape And Reel
Active
EAR99 FRANCE

EMIF06-HMC02F2

Package

Chip Scale Package 0.5mm pitch

Packing Type

Tape And Reel

Budgetary Price (US$)*/Qty

Marketing Status

Active

Budgetary Price (US$)* / Qty

ECCN (US)

EAR99

Country of Origin

FRANCE

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors