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The EMIF06-HSD03F3 chip is a highly integrated device designed to suppress EMI/RFI noise for interface line filtering.
The EMIF06-HSD03F3 Flip-Chip packaging means the package size is equal to the die size. That’s why EMIF06-HSD03F3 is a very small device. Additionally, this filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 18 kV.
Key Features
- Very low line capacitance to compensate long PCB tracks (2.5 pF typ.)
- High efficiency in ESD suppression up to 18 kV (IEC 61000-4-2)
- Very low PCB space consumption:
- 1.1 x 2.4 mm
- Ultralow leakage current: 20 nA max.
- Very thin package: 0.605 mm
- Smart pinout for easier PCB layout
- High reduction of parasitic elements through integration and wafer level packaging
- Lead-free package
- Complies with the following standards:
- IEC 61000-4-2 level 4:±15 kV (air discharge), ±8 kV (contact discharge)
Sample & Buy
| Part Number | Package | Packing Type | Marketing Status | Budgetary Price (US$)* | Quantity | ECCN (US) | Country of Origin | Order from Distributors | Order from ST |
|---|---|---|---|---|---|---|---|---|---|
| EMIF06-HSD03F3 | Flip-Chip 400u | Tape And Reel | Active | - | - | EAR99 | CHINA | Check Availability | Get sample |
(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
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| Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|---|
| EMIF06-HSD03F3 | Active | Flip-Chip 400u | Industrial | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
