Product overview
Description
The EMIF06-HSD03F3 chip is a highly integrated device designed to suppress EMI/RFI noise for interface line filtering. The EMIF06-HSD03F3 Flip-Chip packaging means the package size is equal to the die size. That’s why EMIF06-HSD03F3 is a very small device. Additionally, this filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 18 kV.-
All features
- Very low line capacitance to compensate long PCB tracks (2.5 pF typ.)
- High efficiency in ESD suppression up to 18 kV (IEC 61000-4-2)
- Very low PCB space consumption:
- 1.1 x 2.4 mm
- Ultralow leakage current: 20 nA max.
- Very thin package: 0.605 mm
- Smart pinout for easier PCB layout
- High reduction of parasitic elements through integration and wafer level packaging
- Lead-free package
- Complies with the following standards:
- IEC 61000-4-2 level 4:±15 kV (air discharge), ±8 kV (contact discharge)
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All resources
| Resource title | Latest update |
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Product Specifications (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 10 Oct 2016 |
10 Oct 2016
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Application Notes (5)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 13 Sep 2018 |
13 Sep 2018
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| 06 Aug 2019 |
06 Aug 2019
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| 24 Mar 2020 |
24 Mar 2020
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| 13 Sep 2018 |
13 Sep 2018
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| 22 Sep 2015 |
22 Sep 2015
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Technical Notes & Articles (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 25 Aug 2020 |
25 Aug 2020
|
EDA Symbols, Footprints and 3D Models
STMicroelectronics - EMIF06-HSD03F3
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
All resources
| Resource title | Latest update |
|---|
HW Model, CAD Libraries & SVD (2)
| Resource title | Latest update | |||
|---|---|---|---|---|
| ZIP | 11 Sep 2015 |
11 Sep 2015
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| ZIP | 18 Mar 2020 |
18 Mar 2020
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Quality and Reliability
| Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|---|
| EMIF06-HSD03F3 |
Active
|
CSP P 0.4 mm | Industrial | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Order from Distributors | Order from ST | Marketing Status | ECCN (US) | ECCN (EU) | Packing Type | Package | Temperature (°C) | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | |||||||||||
| EMIF06-HSD03F3 | 2 distributors | Free Sample Buy Direct |
Active
|
EAR99 | NEC | Tape And Reel | CSP P 0.4 mm | -30 | 85 | CHINA | ||
(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
