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  • This is a highly integrated 8-line device designed to suppress EMI/RFI noise in all systems exposed to electromagnetic interference.

    This filter includes ESD protection circuitry, which prevents the application from damages when subjected to ESD surges up to 20 kV.

    Key Features

    • High efficiency in EMI filtering in wide filter bandwidth: better than -25 dB from 700MHz to 3.0 GHz
    • Very thin package: 0.6 mm max.
    • High efficiency in ESD suppression on all input and output pins (exceeds IEC61000-4-2 level 4: ±20 kV contact discharge)
    • High reliability offered by monolithic integration
    • High reduction of parasitic elements through integration and wafer level packaging

Sample & Buy

Part Number
Package
Packing Type
Marketing Status
Budgetary Price (US$)*
Quantity
ECCN (US)
Country of Origin
Order from Distributors
Order from ST
EMIF08-VID1F3 Chip Scale Package 0.4mm pitch Tape And Reel
Active
0.19 500 EAR99 CHINA No availability of distributors reported, please contact our sales office

EMIF08-VID1F3

Package

Chip Scale Package 0.4mm pitch

Packing Type

Tape And Reel

Unit Price (US$)

0.19*

Marketing Status

Active

Unit Price (US$)

0.19

Quantity

500

ECCN (US)

EAR99

Country of Origin

CHINA

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

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00 Files selected for download

Technical Documentation

    • Description Version Size Action
      DS12068
      8-line low capacitance EMI filter and ESD protection
      1.0
      576.21 KB
      PDF
      DS12068

      8-line low capacitance EMI filter and ESD protection

    • Description Version Size Action
      AN5241
      Fundamentals of ESD protection at system level
      1.1
      1.45 MB
      PDF
      AN3353
      IEC 61000-4-2 standard testing
      1.2
      171.08 KB
      PDF
      AN2348
      IPAD™ 400 µm Flip Chip: package description and recommendations for use
      5.0
      261.7 KB
      PDF
      AN1235
      IPAD™ 500 µm Flip Chip: package description and recommendations for use
      8.0
      251.82 KB
      PDF
      AN5241

      Fundamentals of ESD protection at system level

      AN3353

      IEC 61000-4-2 standard testing

      AN2348

      IPAD™ 400 µm Flip Chip: package description and recommendations for use

      AN1235

      IPAD™ 500 µm Flip Chip: package description and recommendations for use

    • Description Version Size Action
      TA0318
      EMI and ESD consideration for LCD and cameras in wireless handsets
      1.2
      115.85 KB
      PDF
      TN1173
      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches
      6.0
      444.57 KB
      PDF
      TA0318

      EMI and ESD consideration for LCD and cameras in wireless handsets

      TN1173

      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
EMIF08-VID1F3
Active
Chip Scale Package 0.4mm pitch Industrial Ecopack2

EMIF08-VID1F3

Package:

Chip Scale Package 0.4mm pitch

Material Declaration**:

PDF XML

Marketing Status

Active

Package

Chip Scale Package 0.4mm pitch

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.