Product overview
Description
The MLPF-WB-01E3 integrates an impedance matching network and harmonics filter. The matching impedance network has been tailored to maximize the RF performance of STM32WB. This device uses STMicroelectronics IPD technology on non-conductive glass substrate which optimizes RF performance.-
All features
- Integrated impedance matching to STM32WB55Cx/Rx, STM32WB50Cx, STM32WB35Cx and STM32WB30Cx
- LGA footprint compatible
- 50 Ω nominal impedance on antenna side
- Deep rejection harmonics filter
- Low insertion loss
- Small footprint
- Low thickness ≤ 450 μm
- High RF performance
- RF BOM and area reduction
- ECOPACK2 compliant
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All resources
| Resource title | Latest update |
|---|
Product Specifications (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 12 Nov 2020 | 12 Nov 2020 |
Application Notes (2)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 13 Sep 2018 | 13 Sep 2018 | |||
| 22 Sep 2015 | 22 Sep 2015 |
Technical Notes & Articles (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 25 Aug 2020 | 25 Aug 2020 |
Flyers (2)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 18 Aug 2020 | 18 Aug 2020 | |||
| 05 Nov 2020 | 05 Nov 2020 |
Brochures (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 19 Sep 2019 | 19 Sep 2019 |
EDA Symbols, Footprints and 3D Models
STMicroelectronics - MLPF-WB-01E3
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|---|
| MLPF-WB-01E3 | Active | FLIP CHIP BUMPLESS CSPG | Industrial | Ecopack2 | |
MLPF-WB-01E3
Package:
FLIP CHIP BUMPLESS CSPGMaterial Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Order from Distributors | Order from ST | Package | Packing Type | Minimum Sellable Quantity | Marketing Status | ECCN (US) | Country of Origin | Budgetary Price (US$)*/Qty | |
|---|---|---|---|---|---|---|---|---|---|---|
| MLPF-WB-01E3 | No availability of distributors reported, please contact our sales office | FLIP CHIP BUMPLESS CSPG | Tape And Reel | 5000 | Active | EAR99 | CHINA | 0.12 / 500 |
Package
FLIP CHIP BUMPLESS CSPGPacking Type
Tape And ReelBudgetary Price (US$)*/Qty
0.12 / 500(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
