Product overview
Key Benefits
Feature Rich platform for your Bluetooth Low Energy applications
Rich functionalities with MEMS sensors, LEDs, flexible power supply, and SMA connector. Excellent for design and testing.
An excellent reference Hardware for design development and testing
Test RF performance, power consumption, and integration with other boards and components using B-WB1M-WPAN1. Also serves as a reference design with many resources. Open hardware platform.
Open Hardware platform and including many resources
B-WB1M-WPAN1 is an open hardware platform supporting several IDEs such as IAR Embedded Workbench®, MDK-ARM, and STM32CubeIDE. It also comes with many online resources including ST Wiki and CubeFW.
Description
The B-WB1M-WPAN1 STM32WB connectivity expansion board provides an affordable and flexible way for users to try out new concepts and build prototypes with the STM32WB series STM32WB1MMC microcontroller module.
The B-WB1M-WPAN1 product requires a separate probe for programming and debugging. The STLINK-V3SET debugger can be connected through a MIPI10/STDC14 cable.
The B-WB1M-WPAN1 STM32WB connectivity expansion board is provided with a USB Type-C® connector (for power only) on an add-on STMod+ adapter board.
The B-WB1M-WPAN1 product is provided with the STM32WB comprehensive software HAL library and various packaged software examples available with the STM32CubeWB MCU Package.
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All features
- STM32WB connectivity expansion board embedding an STM32WB1MMC module including:
- Ultra‑low‑power STM32WB15CCY dual‑core Arm® Cortex®‑M4/M0+, Bluetooth® Low Energy 5.4, AES‑256, featuring 320 Kbytes of flash memory and 48 Kbytes of SRAM in a WLCSP49 package
- RF transceiver multistandard radio Bluetooth® Low Energy, compliant with Bluetooth® specification 5.4 with 1 and 2 Mbit/s transfer rates
- 256‑Kbit serial I2C bus EEPROM
- MEMS sensors from STMicroelectronics:
- Integrated high-accuracy temperature sensor
- 3D accelerometer and 3D gyroscope
- User LED
- User and reset push-buttons
- Board connectors:
- MIPI® debug
- STMod+
- USB Type-C® for power only on add‑on STMod+ adapter board
- Flexible power supply options: external sources, or USB VBUS from the add‑on board
- Comprehensive free software libraries and examples available with the STM32CubeWB MCU Package
- Support of a wide choice of Integrated Development Environments (IDEs) including IAR Embedded Workbench®, MDK-ARM, and STM32CubeIDE
- STM32WB connectivity expansion board embedding an STM32WB1MMC module including:
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Featured Videos
Watch the short video for a quick overview of the STM32WB1M module and the dedicated B-WB1M-WPAN1 development board.
Recommended Tools & Software
All tools & software
All resources
| Resource title | Version | Latest update |
|---|
Product Specifications (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.0 | 18 Oct 2023 | 18 Oct 2023 |
Technical Notes & Articles (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 5.0 | 07 Mar 2023 | 07 Mar 2023 |
User Manuals (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.0 | 06 Nov 2023 | 06 Nov 2023 |
Presentations (2)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 23.06 | 20 Jun 2023 | 20 Jun 2023 | ||
| 23.11 | 07 Nov 2023 | 07 Nov 2023 |
Flyers (2)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 23.11 | 06 Nov 2023 | 06 Nov 2023 | ||
| 23.11 | 05 Nov 2023 | 05 Nov 2023 |
License Agreement (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 30 Sep 2016 | 30 Sep 2016 |
Evaluation Board Terms of Use (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.7 | 29 May 2023 | 29 May 2023 |
All resources
| Resource title | Version | Latest update |
|---|
Board Manufacturing Specifications (4)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| ZIP | 1.0 | 02 Aug 2023 | 02 Aug 2023 | |
| ZIP | 1.0 | 02 Aug 2023 | 02 Aug 2023 | |
| ZIP | 1.0 | 23 Nov 2023 | 23 Nov 2023 | |
| ZIP | 1.0 | 23 Nov 2023 | 23 Nov 2023 |
Bill of Materials (2)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| ZIP | 1.0 | 02 Aug 2023 | 02 Aug 2023 | |
| ZIP | 1.0 | 23 Nov 2023 | 23 Nov 2023 |
Schematic Pack (2)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.0 | 02 Aug 2023 | 02 Aug 2023 | ||
| 1.0 | 23 Nov 2023 | 23 Nov 2023 |
Quality and Reliability
| Part Number | Marketing Status | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|
| B-WB1M-WPAN1 | Active | Ecopack1 | |
B-WB1M-WPAN1
Package:
Ecopack1Material Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Marketing Status | Budgetary Price (US$)*/Qty | Order from ST | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Supplier | Specific features | WEEE Compliant | Core Product | Supplier | Specific features | WEEE Compliant | Core Product | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| B-WB1M-WPAN1 | | | distributors No availability of distributors reported, please contact our sales office | FRANCE | EAR99 | NEC | ST | - | - | STM32WB1MMC | ST | - | - | STM32WB1MMC |
B-WB1M-WPAN1 Active
(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors