Standard Serial EEPROM are competitive products designed for flexible and reliable management of parameters in Smart Things, Smart Homes/Cities as well as Smart Industry with extended temperature ranges. Products feature up to 4 million write/erase cycles per byte, over 100 million cycles per device and 200 years data retention.
The Industrial 85 °C line offers products with a focus on low voltage, low pin-count and the smallest form factor to fit mobile, consumer and computer applications. Packages such as DFN8, DFN5, WLCSP 8/4 balls and bare die allow to fit in the tiniest modules. Low-power operation also makes them ideal for battery-operated wearable modules.
|I2C – M24xxx||1 Kbit to 2 Mbits||1.6 to 5.5 V||Up to 1 MHz||I2C EEPROM|
|SPI – M95xxx||1 Kbit to 4 Mbits||1.7 to 5.5 V||Up to 20 MHz||SPI EEPROM|
|Microwire – M93xxx||1 to 16 Kbits||2.5 to 5.5 V||Up to 2 MHz||Microwire EEPROM|
Industrial-Plus 105 °C products are proposed in SO8N and TSSOP8 packages to design robust solutions for Smart Cities such as networking, power and lighting in outdoor applications. Products offer improved traceability thanks to a lockable page and extended operating temperature ranges.
|I2C – M24xxx||2 to 512 Kbits||1.7 to 5.5 V||Lockable page||I2C EEPROM|
|SPI – M95xxx||4 to 512 Kbits||1.7 to 5.5 V||Lockable page||SPI EEPROM|
Gain development time by using the IBIS and Verilog models available in Resources.
Benefits of I2C EEPROM in DFN5 package
4-ball WLCSP EEPROM designed for tiny Camera modules.
Camera modules for mobile devices follow a path of quick miniaturization while display resolution increases and requires a higher set of parameters to operate efficiently.
The 4-ball WLCSP I2C EEPROM family provides a minimal pin count, footprint and thickness, fitting the most stringent hardware design requirements. In addition, thanks to internally-wired device select code options, the EEPROM for rear and front cameras can share the same I2C bus, providing further module design optimization.
The factory-programmed settings can also be protected when selecting products with the software write-protect instruction.
Manufacturing robustness aspects are also covered with an optional back-side coating.