LSM6DS3

The LSM6DS3 is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 1.25 mA (up to 1.6 kHz ODR) in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.

The LSM6DS3 supports main OS requirements, offering real, virtual and batch sensors with 8 kbyte for dynamic data batching.

ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.

The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.

The LSM6DS3 has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.

High robustness to mechanical shock makes the LSM6DS3 the preferred choice of system designers for the creation and manufacturing of reliable products.

The LSM6DS3 is available in a plastic land grid array (LGA) package.

Key Features

Power consumption: 0.9 mA in combo normal mode and 1.25 mA in combo high-performance mode up to 1.6 kHz.
“Always-on” experience with low power consumption for both accelerometer and gyroscope
Smart FIFO up to 8 kbyte based on features set
Compliant with Android K and L
Hard, soft ironing for external magnetic sensor corrections
±2/±4/±8/±16 g full scale
±125/±250/±500/±1000/±2000 dps full scale
Analog supply voltage: 1.71 V to 3.6 V
Independent IOs supply (1.62 V)
Compact footprint, 2.5 mm x 3 mm x 0.83 mm
SPI/I²C serial interface with main processor data synchronization feature
Embedded temperature sensor
ECOPACK^®, RoHS and “Green” compliant

Resources

Technical Documentation

Product Specifications

	Description	Version	Size
	DS10591: iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope	10.0	1 MB

Application Notes

	Description	Version	Size
	AN4650: LSM6DS3: always-on 3D accelerometer and 3D gyroscope	5.0	1 MB

Technical Notes & Articles

	Description	Version	Size
	TN0018: Surface mounting guidelines for MEMS sensors in an LGA package	6.0	214 KB

Design Notes & Tips

Description	Version	Size
DT0105: 1-point or 3-point tumble sensor calibration	1.0	148 KB
DT0053: 6-point tumble sensor calibration	1.0	464 KB
DT0060: Exploiting the gyroscope to update tilt measure and e-compass	2.0	657 KB
DT0047: How to install and run the osxMotionAR Activity Recognition library	1.3	275 KB
DT0064: Noise analysis and identification in MEMS sensors, Allan, Time, Hadamard, Overlapping, Modified, Total variance	1.0	616 KB
DT0106: Residual linear acceleration by gravity subtraction to enable dead-reckoning	1.0	192 KB

Publications and Collaterals

Flyers

	Description	Version	Size
	iNEMO® always-on 6-axis inertial module	1.0	648 KB

Brochures

	Description	Version	Size
	MEMS and Sensors Smart Motion tracking, IoT and enhanced user experience	1.0	1 MB
	Sensor & motion algorithm software pack for STM32Cube	1.0	544 KB

Tools and Software

Ecosystems

Cloud

Part Number	Manufacturer	Description
AWS IoT Core	AWS	AWS IoT Core is a managed cloud platform that lets connected devices easily and securely interact with cloud applications and other devices.
AZURE Cloud	Microsoft	Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks.
Watson IoT Platform	IBM	IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices.

Embedded Software

MCU & MPU Embedded Software

Part Number	Manufacturer	Description
X-CUBE-MEMS-XT1	ST	Sensor and DSP algorithm software expansion for STM32Cube
X-CUBE-MEMS1	ST	Sensor and motion algorithm software expansion for STM32Cube

MEMS and Sensors Software

Part Number	Manufacturer	Description
AndroidHAL-IIO	ST	Android sensor HAL for MEMS motion and environmental sensors (Industrial I/O framework)
AndroidHALInput	ST	Android sensor HAL for MEMS motion and environmental sensors (Input framework)
C-Driver-MEMS	ST	Standard C platform-independent drivers for MEMS motion and environmental sensors
LinuxDriverIIO	ST	Linux device drivers for MEMS motion and environmental sensors (Industrial I/O framework)
LinuxDriverInput	ST	Linux device drivers for MEMS motion and environmental sensors (Input framework)

Evaluation Tools

Product Evaluation Tools

Part Number	Manufacturer	Description
STEVAL-MKI160V1	ST	LSM6DS3 adapter board for standard DIL24 socket

Solution Evaluation Tools

Part Number	Manufacturer	Description
STEVAL-WESU1	ST	Wearable sensor unit reference design for fast time to market

Part Number	Package	Packing Type	Marketing Status	Unit Price (US$) *	Quantity	ECCN (US)	Country of Origin	More info	Order from ST	Order from Distributors
LSM6DS3TR	VFLGA 2.5X3X0.86 14L	Tape And Reel	Active : Product is in volume production	1.771	1000	EAR99	-	MORE INFO	Free Sample Add to cart	DISTRIBUTOR AVAILABILITY
LSM6DS3	VFLGA 2.5X3X0.86 14L	Tray	Active : Product is in volume production	-	-	EAR99	-	MORE INFO		DISTRIBUTOR AVAILABILITY

Part Number	Marketing Status	Package	RoHS Compliance Grade	Material Declaration**
LSM6DS3TR	Active	VFLGA 2.5X3X0.86 14L	Ecopack2
LSM6DS3	Active	VFLGA 2.5X3X0.86 14L	Ecopack2

Resources

Technical Documentation

Publications and Collaterals

Tools and Software

Featured Videos

Sample & Buy

Quality & Reliability

No availability reported, please contact our Sales office