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The LSM6DS3 is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 1.25 mA (up to 1.6 kHz ODR) in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.
The LSM6DS3 supports main OS requirements, offering real, virtual and batch sensors with 8 kbyte for dynamic data batching.
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.
The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
The LSM6DS3 has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
High robustness to mechanical shock makes the LSM6DS3 the preferred choice of system designers for the creation and manufacturing of reliable products.
The LSM6DS3 is available in a plastic land grid array (LGA) package.Key Features
- Power consumption: 0.9 mA in combo normal mode and 1.25 mA in combo high-performance mode up to 1.6 kHz.
- “Always-on” experience with low power consumption for both accelerometer and gyroscope
- Smart FIFO up to 8 kbyte based on features set
- Compliant with Android K and L
- Hard, soft ironing for external magnetic sensor corrections
- ±2/±4/±8/±16 g full scale
- ±125/±250/±500/±1000/±2000 dps full scale
- Analog supply voltage: 1.71 V to 3.6 V
- Independent IOs supply (1.62 V)
- Compact footprint, 2.5 mm x 3 mm x 0.83 mm
- SPI/I2C serial interface with main processor data synchronization feature
- Embedded temperature sensor
- ECOPACK®, RoHS and “Green” compliant
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Product Specifications (1)
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| 14 May 2018 |
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Application Notes (1)
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| 29 Jan 2018 |
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Technical Notes & Articles (1)
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| 18 Nov 2020 |
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Design Notes & Tips (5)
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Application Notes for related Tools & Software (1)
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Flyers (4)
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Brochures (4)
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EDA Symbols, Footprints and 3D Models
STMicroelectronics - LSM6DS3
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
Quality and Reliability
| Part Number | Marketing Status | Package | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|
| LSM6DS3TR |
NRND
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VFLGA 2.5X3X0.86 14L | Ecopack2 |
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LSM6DS3TR
Package:
VFLGA 2.5X3X0.86 14LMaterial Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Order from Distributors | Order from ST | Marketing Status | ECCN (US) | ECCN (EU) | Packing Type | Package | Temperature (°C) | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | |||||||||||
| LSM6DS3TR | 4 distributors |
NRND
|
EAR99 | NEC | Tape And Reel | VFLGA 2.5X3X0.86 14L | -40 | 85 | PHILIPPINES | 1.771 / 1k | ||
Marketing Status
NRNDECCN (US)
EAR99Budgetary Price (US$)*/Qty
1.771 / 1k(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
