LSM6DS3US

NRND

iNEMO 6DoF inertial measurement unit (IMU), specifically designed for PC. It includes 8kB FIFO (4kB programmable)

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Product overview

Description

The LSM6DS3US is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 1.1 mA (up to 1.6 kHz ODR) in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer. The LSM6DS3US supports main OS requirements, offering real, virtual and batch sensors with 4 kbyte FIFO + flexible 4 kbyte (FIFO or programmable) for dynamic data batching.
The LSM6DS3US gyroscope supports both OIS/EIS applications. The device can be connected to the camera module through a dedicated auxiliary SPI (Mode 3) while flexibility for the primary interface is available (I2C/SPI).
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.
The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
The LSM6DS3US has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
High robustness to mechanical shock makes the LSM6DS3US the preferred choice of system designers for the creation and manufacturing of reliable products.
The LSM6DS3US is available in a plastic land grid array (LGA) package.
  • All features

    • Power consumption: 0.85 mA in combo normal mode and 1.1 mA in combo high-performance mode up to 1.6 kHz.
    • “Always-on” experience with low power consumption for both accelerometer and gyroscope
    • Interface flexibility: selectable SPI (3/4-wire) or I2C with the main processor
    • Auxiliary SPI (3-wire) to support OIS applications
    • EIS/OIS support
    • Accelerometer ODR up to 6.66 kHz
    • Gyroscope ODR up to 3.33 kHz
    • Smart FIFO
    • ±2/±4/±8/±16 g full scale
    • ±125/±250/±500/±1000/±2000 dps full scale
    • Analog supply voltage: 1.71 V to 3.6 V
    • Independent IOs supply (1.62 V)
    • Compact footprint, 2.5 mm x 3 mm x 0.83 mm
    • SPI/I2C serial interface data synchronization feature
    • Embedded temperature sensor
    • ECOPACK®, RoHS and “Green” compliant

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EDA Symbols, Footprints and 3D Models

STMicroelectronics - LSM6DS3US

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Quality and Reliability

Part Number Marketing Status Package RoHS Compliance Grade Material Declaration**
LSM6DS3USTR
NRND
VFLGA 2.5X3X0.86 14L Ecopack2

LSM6DS3USTR

Package:

VFLGA 2.5X3X0.86 14L

Material Declaration**:

PDF XML

Marketing Status

NRND

Package

VFLGA 2.5X3X0.86 14L

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

Part Number
Order from Distributors
Order from ST
Marketing Status
ECCN (US)
ECCN (EU)
Packing Type
Package
Temperature (°C) Country of Origin
Budgetary Price (US$)*/Qty
min
max
LSM6DS3USTR No availability of distributors reported, please contact our sales office
NRND
EAR99 NEC Tape And Reel VFLGA 2.5X3X0.86 14L -40 85 PHILIPPINES

LSM6DS3USTR

Marketing Status

NRND

ECCN (US)

EAR99

Budgetary Price (US$)*/Qty

ECCN (EU)

NEC

Packing Type

Tape And Reel

Package

VFLGA 2.5X3X0.86 14L

Operating Temperature (°C)

(min)

-40

(max)

85

Budgetary Price (US$)* / Qty

Country of Origin

PHILIPPINES

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors