The LSM6DSM is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 0.65 mA in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.
The LSM6DSM supports main OS requirements, offering real, virtual and batch sensors with 4 kbyte for dynamic data batching.
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.
The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
The LSM6DSM has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
The LSM6DSM fully supports EIS and OIS applications as the module includes a dedicated configurable signal processing path for OIS and auxiliary SPI configurable for both the gyroscope and accelerometer.
High robustness to mechanical shock makes the LSM6DSM the preferred choice of system designers for the creation and manufacturing of reliable products.
The LSM6DSM is available in a plastic land grid array (LGA) package.
|DS11179: iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope||7.0||1 MB|
|AN4987: LSM6DSM: always-on 3D accelerometer and 3D gyroscope||5.0||1 MB|
|TN0018: Surface mounting guidelines for MEMS sensors in an LGA package||6.0||214 KB|
|DT0105: 1-point or 3-point tumble sensor calibration||1.0||148 KB|
|DT0064: Noise analysis and identification in MEMS sensors, Allan, Time, Hadamard, Overlapping, Modified, Total variance||1.0||616 KB|
|DT0106: Residual linear acceleration by gravity subtraction to enable dead-reckoning||1.0||192 KB|
|LSM6DSM iNEMO® always-on 6-axis inertial module||663 KB|
|MEMS and Sensors, Smart solutions for IoT and enhanced user experience||1 MB|
|Optical Image Stabilization (OIS) - white paper||1.0||3 MB|
|AndroidHAL-IIO||ST||Android sensor HAL for MEMS motion and environmental sensors (Industrial I/O framework)|
|AndroidHALInput||ST||Android sensor HAL for MEMS motion and environmental sensors (Input framework)|
|C-Driver-MEMS||ST||Standard C platform-independent drivers for MEMS motion and environmental sensors|
|LinuxDriverIIO||ST||Linux device drivers for MEMS motion and environmental sensors (Industrial I/O framework)|
|LinuxDriverInput||ST||Linux device drivers for MEMS motion and environmental sensors (Input framework)|
|STEVAL-MKI189V1||ST||LSM6DSM adapter board for a standard DIL24 socket|
|STREF-MKI128V6||Smart MEMS Multi-sensor module|
|Part Number||Package||Packing Type||Marketing Status||Unit Price (US$) *||Quantity||ECCN (US)||Country of Origin||More info||Order from ST||Order from Distributors|
|LSM6DSMTR||VFLGA2.5X3X.86 14L P.5 L.475X.25||Tape And Reel||Active : Product is in volume production||2.5||1000||EAR99||PHILIPPINES||MORE INFO||Free Sample Add to cart||DISTRIBUTOR AVAILABILITY|
|Part Number||Marketing Status||Package||RoHS Compliance Grade||Material Declaration**|
|LSM6DSMTR||Active||VFLGA2.5X3X.86 14L P.5 L.475X.25||Ecopack2|
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.