The Teseo-LIV3F module is an easy to use Global Navigation Satellite System (GNSS) standalone module, embedding TeseoIII single die standalone positioning receiver IC working simultaneously on multiple constellations (GPS/Galileo/Glonass/BeiDou/QZSS).
The Teseo-LIV3F modules bring the proven accuracy and robustness of Teseo chips to the reach of everyone: the embedded firmware and the complete evaluation environment save development time, while the compactness and cost-effectiveness of this solution make it ideal for several applications, such as insurance, goods tracking, drones, tolling, anti-theft systems, people and pet location, vehicle tracking, emergency calls, fleet management, vehicle sharing, diagnostics and public transportation.
Within its 9.7x10.1 mm tiny size, Teseo-LIV3F is offerinDS12152g superior accuracy thanks to the on board 26 MHz Temperature Compensated Crystal Oscillator (TCXO) and a reduced Time To First Fix (TTFF) relying to its dedicated 32 KHz Real Time Clock (RTC) oscillator.
Thanks to the embedded 16 Mbit flash Teseo-LIV3F offers many extra features such as data logging, 7 days autonomous assisted GNSS, FW reconfigurability as well as FW upgrades.
Teseo-LIV3F provides also the Autonomous Assisted GNSS able to predict satellite data based on previous observation of satellite.
Teseo-LIV3F module, being a certified solution, optimizes the time to market of the final applications with a temperature operating range from -40°C to 85°C.
|DS12152: Tiny GNSS module||5.0||834 KB|
|AN5160: RxNetworks Assisted GNSS Server Interface Specification||1.1||863 KB|
|AN5203: Teseo-LIV3F - I2C Positioning Sensor||1.0||2 MB|
|UM2231: Teseo-LIV3F GNSS Module - Hardware Manual||3.0||567 KB|
|UM2229: Teseo-LIV3F GNSS Module - Software Manual||2.0||2 MB|
|Teseo-LIV3F 3D CAD model||1.0||26 KB|
|Using the Teseo-LIV3F as an I2C Positioning Sensor||1.0||535 KB|
|Teseo-LIV3F - Tiny GNSS Module||1.0||701 KB|
|X-NUCLEO-GNSS1A1||ST||GNSS expansion board based on Teseo-LIV3F module for STM32 Nucleo|
|EVB-LIV3F||TESEO LIV3F module evaluation board|
|Part Number||Package||Packing Type||Marketing Status||Unit Price (US$) *||Quantity||ECCN (US)||Country of Origin||More info||Order from ST||Order from Distributors|
|TESEO-LIV3F||RF MODULE||Tape And Reel||Active : Product is in volume production||-||-||7A994||-||MORE INFO||DISTRIBUTOR AVAILABILITY|
|Part Number||Marketing Status||Package||Grade||RoHS Compliance Grade||Material Declaration**|
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.