STWLC38

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Qi-compliant inductive wireless power receiver for 15W applications

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Product overview

Description

The STWLC38 is a highly integrated wireless power receiver solution suitable for applications up to 15W. The chip has been designed to support Qi 1.3 specifications for inductive communication protocol, Base Power Profile and Extended Power Profile (BPP, 5W max, EPP 15W max).
The STWLC38 shows excellent efficiency performance thanks to the integrated low-loss synchronous rectifier and the low drop-out linear regulator: both elements are dynamically managed by the digital core to minimize the overall power dissipation over a wide range of output load conditions.
STWLC38 features embedded RRAM (Resistive RAM) non-volatile memory to enable I2C interface customization and support of proprietary communication and charging protocols
Additional firmware patching also improves the application flexibility of STWLC38.
STWLC38 is also capable of operating in Tx mode to transmit power to charge other devices, the output power can be up to 5W depending on the coil used.
The STWLC38 is housed in a Chip-Scale Package to fit real-estate sensitive applications like wearable devices.
  • All features

    • Up to 15 W output power
    • Up to 5W output power in Tx mode
    • Qi 1.3 inductive wireless standard communication protocol compliant
    • High efficiency (98% typical) synchronous rectifier operating up to 800 kHz
    • Low drop-out linear regulator with output current limit and input voltage control loop
    • Adaptive Rectifier Configuration (ARC) Mode for enhanced spatial freedom
    • 4 V to 12 V programmable output voltage
    • Above 85% overall system efficiency
    • 32-bit, 64 MHz ARM Cortex M0+ core with 32kB RRAM,16 kB SRAM,64kB ROM
    • 10-bit A/D Converter
    • Configurable GPIOs
    • Up to 1Mhz I2C Slave interface
    • Multi-level ASK modulator, Enhanced FSK demodulator
    • Output Over-Voltage clamping protection
    • Accurate voltage/current measurement for Foreign Object Detection (FOD)
    • On-chip thermal management and protections
    • Flip chip 40 bumps (2.12mm x 3.32mm)

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STMicroelectronics - STWLC38

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Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
STWLC38JRM
Active
WLCSP40 2.126X3.327X0.546 0.4P 0 Industrial N/A

STWLC38JRM

Package:

WLCSP40 2.126X3.327X0.546 0.4P 0

Material Declaration**:

Marketing Status

Active

Package

WLCSP40 2.126X3.327X0.546 0.4P 0

Grade

Industrial

RoHS Compliance Grade

N/A

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

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Part Number
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Marketing Status
ECCN (US)
ECCN (EU)
Packing Type
Package
Temperature (°C) Grade
Budgetary Price (US$)*/Qty
Unit Price (US$)
Country of Origin
Output Power (W) (typ)
min
max
STWLC38JRM No availability of distributors reported, please contact our sales office
Active
EAR99 NEC Tape and Reel WLCSP40 2.126X3.327X0.546 0.4P 0 -40 85 Industrial

2.175

SOUTH KOREA

15

STWLC38JRM Active

Package:
WLCSP40 2.126X3.327X0.546 0.4P 0
ECCN (US):
EAR99
Budgetary Price (US$)*/Qty:
-

Part Number:

STWLC38JRM

ECCN (EU):

NEC

Packing Type:

Tape and Reel

Operating Temperature (°C)

Min:

-40

Max:

85

Grade:

Industrial

Country of Origin:

SOUTH KOREA

Output Power (W) (typ):

15

No availability of distributors reported, please contact our sales office
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(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors