STWLC38

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Qi-compliant inductive wireless charger power receiver for up to 15W applications

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Product overview

Description

The STWLC38 is an integrated Wireless Power Receiver suitable for wearable/hearable and smart phone applications and can supply up to 15 W of output power. The chip has been designed to support Qi 1.3 specifications for inductive communication protocol, 5W Baseline Power Profile and 15W Extended Power Profile.STWLC38 shows excellent efficiency performance thanks to the integrated low-loss synchronous rectifier and the low drop-out linear regulator: both elements are dynamically managed by the digital core to minimize the overall power dissipation over a wide range of output load conditions.Through the I2C interface the user can access and modify different configuration parameters, tailoring the operation of the device to the needs of custom applications. The configuration parameters can be saved in the embedded Resistive RAM (RRAM) and automatically retrieved at power-up.STWLC38 is also capable of operating in Tx mode to transmit power to charge other devices. The device can provide power up to 5W Output power in this mode. The STWLC38 is housed in a Chip-Scale Package to fit real-estate sensitive solutions in wearable devices.

  • All features

    • Up to 15 W output power
    • Up to 5W output power in Tx mode
    • Qi 1.3 inductive wireless standard communication protocol compliant
    • High efficiency (98% typical) synchronous rectifier operating up to 800 kHz
    • Low drop-out linear regulator with output current limit and input voltage control loop
    • Adaptive Rectifier Configuration (ARC) Mode for enhanced spatial freedom
    • 4 V to 12 V programmable output voltage
    • Above 85% overall system efficiency
    • 32-bit, 64 MHz ARM Cortex M0+ core with 32kB RRAM,16 kB SRAM,64kB ROM
    • 10-bit A/D Converter
    • Configurable GPIOs
    • I2C Slave interface
    • Multi-level ASK modulator, Enhanced FSK demodulator
    • Output Over-Voltage clamping protection
    • Accurate voltage/current measurement for Foreign Object Detection (FOD)
    • On-chip thermal management and protections
    • Flip chip 40 bumps (2.12mm x 3.32mm)

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STMicroelectronics - STWLC38

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Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
STWLC38JRM
Active
WLCSP40 2.126X3.327X0.546 0.4P 0 Industrial N/A

STWLC38JRM

Package:

WLCSP40 2.126X3.327X0.546 0.4P 0

Material Declaration**:

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Active

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WLCSP40 2.126X3.327X0.546 0.4P 0

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Industrial

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N/A

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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