A1P50S65M2-F

Active

ACEPACK 1 sixpack topology, 650 V, 50 A trench gate field-stop IGBT M series, soft diode and NTC

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  • This power module is a sixpack topology in an ACEPACK™ 1 package with NTC, integrating the advanced trench gate field-stop technologies from STMicroelectronics. This new IGBT technology represents the best compromise between conduction and switching loss, to maximize the efficiency of any converter system up to 20 kHz.

    Key Features

    • ACEPACK™ 1 power module
      • DBC Cu Al2O3 Cu
    • Sixpack topology
      • 650 V, 50 A IGBTs and diodes
      • Soft and fast recovery diode
    • Integrated NTC

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Part Number
Marketing Status
Package
Packing Type
Temperature (°C) ECCN (US)
Country of Origin
Budgetary Price (US$)*/Qty
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A1P50S65M2-F
Active
ACEPACK 1 Tray - - EAR99 PHILIPPINES 24.0 / 100 No availability of distributors reported, please contact our sales office

A1P50S65M2-F

Marketing Status

Active

Unit Price (US$)

24

Budgetary Price (US$)*/Qty

24.0 / 100

Package

ACEPACK 1

Packing Type

Tray

Operating Temperature (°C)

(min)

-

(max)

-

ECCN (US)

EAR99

Country of Origin

PHILIPPINES

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

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00 Files selected for download

Technical Documentation

    • Description Version Size Action
      DS12333
      ACEPACK™ 1 sixpack topology, 650 V, 50 A, trench gate field‑stop M series IGBT with soft diode and NTC
      3.0
      941.51 KB
      PDF
      DS12333

      ACEPACK™ 1 sixpack topology, 650 V, 50 A, trench gate field‑stop M series IGBT with soft diode and NTC

    • Description Version Size Action
      TN1250
      Press-fit ACEPACK™ power modules mounting instructions
      1.0
      818.09 KB
      PDF
      TN1250

      Press-fit ACEPACK™ power modules mounting instructions

Presentations & Training Material

    • Description Version Size Action
      ACEPACK™ overview 1.1
      3.32 MB
      PDF
      ST PowerStudio overview 1.0
      1.81 MB
      PDF

      ACEPACK™ overview

      ST PowerStudio overview

Publications and Collaterals

    • Description Version Size Action
      ACEPACK: adaptable, compact and easier packages Power Modules 1.0
      1.08 MB
      PDF
      ST PowerStudio: dynamic electro-thermal simulation software for STPOWER devices 1.0
      612.77 KB
      PDF

      ACEPACK: adaptable, compact and easier packages Power Modules

      ST PowerStudio: dynamic electro-thermal simulation software for STPOWER devices

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
A1P50S65M2-F
Active
ACEPACK 1 Industrial Ecopack1

A1P50S65M2-F

Package:

ACEPACK 1

Material Declaration**:

PDF XML

Marketing Status

Active

Package

ACEPACK 1

Grade

Industrial

RoHS Compliance Grade

Ecopack1

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.