STG80H65FBD7

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650 V, 80 A trench gate field-stop HB series high-speed IGBT die in D7 packing

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Product overview

Description

This device is an IGBT developed using an advanced proprietary trench gate field-stop structure. The device is part of the new HB series of IGBTs, which represents an optimum compromise between conduction and switching loss to maximize the efficiency of any frequency converter. Furthermore, the slightly positive VCE(sat) temperature coefficient and very tight parameter distribution result in safer paralleling operation.

  • All features

    • Maximum junction temperature: TJ = 175 °C
    • High-speed switching series
    • Minimized tail current
    • VCE(sat) = 1.6 V (typ.) @ IC = 80 A
    • Tight parameter distribution
    • Safer paralleling

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STMicroelectronics - STG80H65FBD7

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Quality and Reliability

Part Number Marketing Status Grade Material Declaration**
STG80H65FBD7
Active
Industrial

STG80H65FBD7

Package:

Industrial

Material Declaration**:

PDF XML

Marketing Status

Active

Grade

Industrial

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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STG80H65FBD7 Available at distributors

Distributor availability of STG80H65FBD7

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Active
EAR99 NEC Not Applicable D.SCRIB.100% VI STAT - - SINGAPORE

STG80H65FBD7 Active

Package:
D.SCRIB.100% VI STAT
ECCN (US):
EAR99

Part Number:

STG80H65FBD7

ECCN (EU):

NEC

Packing Type:

Not Applicable

Operating Temperature (°C)

Min:

-

Max:

-

Country of Origin:

SINGAPORE

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(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors