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  • The ESDAVLC8-4BN4 is monolithic array designed to protect up to 4 lines against ESD transients. It has been designed specifically for the protection of the high speed interface of integrated circuits in portable equipment and miniaturized electronics devices. The μQFN-4L package minimizes PCB space.

    Key Features

    • Stand-off voltage: 3 V
    • Very low capacitance: 4.5 pF
    • Small package: 1.0 x 0.8 mm
    • Very thin package: 0.40 mm max
    • Low leakage current: 50 nA at 25 °C
    • Benefits
      • High ESD robustness of the equipment
      • Suitable for high speed interface
    • Complies with the following standards:
      • IEC 61000-4-2:
        • ±15 kV (air discharge)
        • ±8 kV (contact discharge)
      • MIL STD 883G- Method 3015-7: class3B:
        • >25 kV (human body model)

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Technical Documentation

    • Description Version Size Action
      DS8640
      4-line very low capacitance Transil™ array for ESD protection
      3.0
      346.77 KB
      PDF
      DS8640

      4-line very low capacitance Transil™ array for ESD protection

    • Description Version Size Action
      AN5241
      Fundamentals of ESD protection at system level
      1.1
      1.45 MB
      PDF
      AN3353
      IEC 61000-4-2 standard testing
      1.2
      171.08 KB
      PDF
      AN5367
      SIMetrix / SIMPLIS: PSpice model import
      1.0
      948.16 KB
      PDF
      AN5241

      Fundamentals of ESD protection at system level

      AN3353

      IEC 61000-4-2 standard testing

      AN5367

      SIMetrix / SIMPLIS: PSpice model import

    • Description Version Size Action
      TA0324
      ESD protection improvement in cellular handsets
      1.2
      134.94 KB
      PDF
      TN1200
      Micro-bump Flip Chip: package description and recommendations for use
      1.0
      280.7 KB
      PDF
      TN1173
      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches
      6.0
      444.57 KB
      PDF
      TA0324

      ESD protection improvement in cellular handsets

      TN1200

      Micro-bump Flip Chip: package description and recommendations for use

      TN1173

      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches

Presentations & Training Material

    • Description Version Size Action
      HSP series portfolio overview : High-speed port ESD protection 1.0
      797.61 KB
      PDF
      Ultra-low capacitance single-line ESD protection portfolio overview: ‘Ultra Low’ (ULC) and ‘eXtra Low’ (XLC) capacitance ESD protection 1.0
      681.96 KB
      PDF

      HSP series portfolio overview : High-speed port ESD protection

      Ultra-low capacitance single-line ESD protection portfolio overview: ‘Ultra Low’ (ULC) and ‘eXtra Low’ (XLC) capacitance ESD protection

Publications and Collaterals

    • Description Version Size Action
      ST Protection Finder - The new app for Android and iOS 1.0
      1.52 MB
      PDF

      ST Protection Finder - The new app for Android and iOS