Product overview
Description
The ESDAVLC8-4BN4 is monolithic array designed to protect up to 4 lines against ESD transients. It has been designed specifically for the protection of the high speed interface of integrated circuits in portable equipment and miniaturized electronics devices. The μQFN-4L package minimizes PCB space.-
All features
- Stand-off voltage: 3 V
- Very low capacitance: 4.5 pF
- Small package: 1.0 x 0.8 mm
- Very thin package: 0.40 mm max
- Low leakage current: 50 nA at 25 °C
- Benefits
- High ESD robustness of the equipment
- Suitable for high speed interface
- Complies with the following standards:
-
IEC 61000-4-2:
- ±15 kV (air discharge)
- ±8 kV (contact discharge)
-
MIL STD 883G- Method 3015-7: class3B:
- >25 kV (human body model)
-
IEC 61000-4-2:
Featured Videos
In this video, we explain why it is important to protect against electrostatic discharges. We give a quick demonstration to show exactly what happens when you shoot at a microcontroller with an ESD gun!
During this one-hour webinar, you will learn how to make your electronic system more robust against destructive Electrostatic Discharges (ESD) by using ST ESD Protection components. Agenda : 1) ESD major root causes and EMC standards, 2) ST ESD Protections which can help to protect your application againts ESD, 3) Many real application examples demonstrating where protections play an important role, 4) How to select the best protection for your usecases
This video is presenting ESD protections and Integrated Passives around the MCU
All tools & software
EDA Symbols, Footprints and 3D Models
STMicroelectronics - ESDAVLC8-4BN4
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
All resources
| Resource title | Version | Latest update |
|---|
CAD Symbol & Footprint models (2)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| ZIP | 1.0 | 02 Apr 2021 |
02 Apr 2021
|
|
| ZIP | 1.0 | 16 Mar 2020 |
16 Mar 2020
|
