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The HSP053-4M5 is a 4 channel ESD array with a rail to rail architecture designed specifically for the protection of high speed differential lines.
The device is packaged in μQFN 1.3 mm x 0.8 mm with a 500 μm pitch.
Key Features
- Very compact 500 µm pitch package, for easy PCB layout
- Ultra-large bandwidth: 18 GHz
- Ultra-low capacitance: 0.15 pF (I/O to I/O) and 0.25 pF (I/O to GND)
- Low leakage current: < 1 nA
- Extended operating junction temperature range: -40 °C to 150 °C
- Thin package: 0.4 mm max.
- RoHS compliant
Sample & Buy
Part Number | Marketing Status | Breakdown Voltage (V) (min) | Directionality | Package | Packing Type | Budgetary Price (US$)* | Quantity | ECCN (US) | Country of Origin | More info | Order from Distributors | Order from ST |
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HSP053-4M5 | Active | 5.3 | Uni-Directional | uDFN-5L | Tape And Reel | 0.063 | 1000 | EAR99 | CHINA | Check Availability | Buy now |
(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
Featured Videos
In this video, we explain why it is important to protect against electrostatic discharges. We give a quick demonstration to show exactly what happens when you shoot at a microcontroller with an ESD gun!
Introduction to surges – EOS and ESD – definition, standards, effects and root cause
Design Tools
Development Tools
Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
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HSP053-4M5 | Active | uDFN-5L | Industrial | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.