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The ST33TPM12LPC is a cost-effective and high performance Trusted Platform Module (TPM) targeting embedded system applications.
This device implements the functions defined by the Trusted Computing Group (www.trustedcomputinggroup.org) in the TCG Trusted Platform Module Specifications version 1.2 Level 2 Revision 116 ([1][2][3]), and is also based on the TCG PC Client specific TPM interface specifications 1.21 [5] and the PC Client implementation specification for conventional BIOS [6] for what concerns the TPM internal register list and bit definitions.
The ST33TPM12LPC is based on a secure MCU hardware platform.
The ST33TPM12LPC is built on a 32-bit ARMĀ® reduced instruction set computing (RISC) processor which provides high cryptographic and general performances. A crypto-processor NESCRYPT is also present to support efficiently all public key cryptographic algorithms.Key Features
- TPM features
- Single-chip Trusted Platform Module (TPM)
- Compliant with Trusted Computing Group (TCG) Trusted Platform Module (TPM) Main specifications 1.2, Level 2, Revision 116
- Based on TCG PC Client Specific TPM Interface Specifications 1.21
- Common criteria (CC) certification based on the certified TPM Protection Profile (Revision 116) with Evaluation Assurance Level (EAL) 4+
- Up to 33-MHz Low Pin Count (LPC) interface V1.1
- Provisioned with Endorsement key and Endorsement Key certificate
- Support of clock suspension for power saving mode
- Support of Field Upgrade and Dictionary Attack protection
- Monotonic counter endurance guaranteed for 7 years
- Support of software and hardware physical presence
- Hardware features
- ARMĀ® SecurCoreĀ® SC300ā¢ 32-bit RISC core
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Highly reliable CMOS EEPROM submicron technology
- 30-year data retention at 25Ā° C
- 500,000 Erase/Write cycles endurance typical at 25Ā° C
- Temperature range: 0Ā°C to +70Ā°C
- ESD protection up to 4 kV (HBM)
- 3.3 V supply voltage range
- 28-lead thin shrink small outline and 32-lead very thin fine pitch quad flat pack ECOPACKĀ® packages
- Security features
- Active shield and environmental sensors
- Memory protection unit (MPU)
- Monitoring of environmental parameters (power and clock)
- Hardware and software protection against fault injection
- AIS-31 Class P2 compliant true random number generator (TRNG)
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Cryptographic algorithms:
- RSA key generation from 512 to 2048 with a 2-byte step
- RSA signature and encryption
- SHA-1 and SHA-256
- AES-128 in CTR mode
- Performance and resource features
- SHA1 computation for 64-byte block: 155 Ī¼s1
- Signature with a 2048-bit key: 150 ms(a)
- Signature with a 1024-bit key: 30 ms(a)
- NV storage allocated space: 4 Kbytes (1.2 Kbytes used by EK certificate)
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Supported 2048-bit key slots:
- up to 10 key slots (without EK and SRK)
- 1 key slot in volatile memory for high-frequency loading use case
- TPM features
Featured Videos
All resources
Product Specifications (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 19 Sep 2016 |
19 Sep 2016
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Technical Notes & Articles (1)
| Resource title | Latest update | |||
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| 03 Jun 2020 |
03 Jun 2020
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Presentations (1)
| Resource title | Latest update | |||
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| 24 Aug 2020 |
24 Aug 2020
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Flyers (1)
| Resource title | Latest update | |||
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| 02 Dec 2020 |
02 Dec 2020
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Brochures (4)
| Resource title | Latest update | |||
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| 28 Aug 2018 |
28 Aug 2018
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| 17 Jul 2020 |
17 Jul 2020
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| 13 Aug 2020 |
13 Aug 2020
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| 23 Nov 2020 |
23 Nov 2020
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TPM Certificates (4)
| Resource title | Latest update | |||
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| ZIP | 29 Jul 2019 |
29 Jul 2019
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| ZIP | 29 Jul 2019 |
29 Jul 2019
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| ZIP | 29 Jul 2019 |
29 Jul 2019
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| ZIP | 29 Jul 2019 |
29 Jul 2019
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EDA Symbols, Footprints and 3D Models
STMicroelectronics - ST33TPM12LPC
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
Quality and Reliability
| Part Number | Marketing Status | Package | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|
| ST33TPM12LPCQFN |
Active
|
VFQFPN 32 5x5x1.0 mm | Ecopack1 | |
| ST33TPM12LPCR28 |
Active
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TSSOP-28 | Ecopack2 |
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(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Order from Distributors | Order from ST | Marketing Status | ECCN (US) | ECCN (EU) | Packing Type | Package | Temperature (Ā°C) | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | |||||||||||
| ST33TPM12LPCR28 | No availability of distributors reported, please contact our sales office |
Active
|
EAR99 | NEC | Tape And Reel | TSSOP-28 | 0 | 70 | PHILIPPINES | |||
| ST33TPM12LPCQFN | No availability of distributors reported, please contact our sales office |
Active
|
EAR99 | NEC | Tape And Reel | VFQFPN 32 5x5x1.0 mm | 0 | 70 | PHILIPPINES | |||
Marketing Status
ActiveECCN (US)
EAR99Budgetary Price (US$)*/Qty
Marketing Status
ActiveECCN (US)
EAR99Budgetary Price (US$)*/Qty
(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your localĀ ST Sales Office Ā or ourĀ Distributors
