ST4SIM-200A

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eSIM System on chip for Automotive Market - eSIM GSMA SGP.02 v3.2 / GP v2.3 / ETSI Rel14 / Javacard 3.0.4 Classic Edition

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  • The ST4SIM-200A is an STMicroelectronics top-class embedded SIM (eSIM or eUICC) product designed for the automotive ecosystem.

    This solution is based on the ST33G1M2A0, an automotive grade hardware solution, AEC-Q100 qualified grade 2.
    The ST4SIM-200A is compliant with the GSM Association (GSMA) remote provisioning specification SGP.02 v3.2. It can remotely manage profiles of different MNOs while ensuring the appropriate security level to all eUICC stakeholders (user, MNO, OEM, hardware integrator, service provider, and so on). The ST4SIM-200A can include an embedded secure element to store credential and/or independent applications directly managed by the MCU (or by another OEM element). The ST4SIM-200A provides a secure and interoperable Java Card environment compliant with Java Card v3.0.4 classic. Moreover, the ST4SIM-200A integrates the most advanced UICC features compliant with GlobalPlatform, ETSI, 3GPP, 3GPP2 specifications. The ST4SIM-200A integrates a dynamic memory management with Java Card garbage collection mechanism optimizing the usage of the memory. The ST4SIM-200A is a tamper-resistant secure element certified by Common Criteria EAL5+, with a powerful 32-bit Arm SecurCore SC300 RISC core.

    Key Features

      • AEC-Q100 qualified Grade 2
      • Remote SIM provisioning compliant with GSMA M2M and SIMalliance specifications
      • Bootstrap connectivity profile
      • Up to 7 profiles (depending on memory size)
      • Compliant with 2G / 3G / 4G (LTE) / CDMA / NB-IoT / CAT–M networks
      • Network access applications supported: SIM / USIM / ISIM / CSIM
      • Secure element access control (ARF / PKCS#15)
      • OTA capability over SMS, CAT-TP & HTTPS (including DNS)
      • Multi-interfaces able to combine eSIM + eSE
    • Hardware
      • Product available on ST33G1M2A0
      • ST33 product based on a 32-bit Arm SecurCore SC300 RISC core
      • Supply voltage: Class A (5 V), Class B (3 V), Class C (1.8 V)
      • Asynchronous serial I/O port ISO/IEC 7816-3 compatible (T=0 protocol)
      • Serial Peripheral Interface (SPI), depending on packages
      • Automotive qualification (AEC-Q100 Grade 2)
      • Operating temperature: -40°C to +105°C
      • Common Criteria EAL5+
    • ECOPACK-compliant packages
      • DFN8 Wettable Flank (MFF2)
      • TSSOP20
    • Security
      • Symmetric cryptography DES / 3DES / AES
      • Asymmetric cryptography RSA (up to 2048 bits)
      • HTTPS remote management TLS v1.0, v1.1 and v1.2
      • Elliptic curve cryptography (up to 521 bits) including preloaded curve NIST P-256 and brainpoolP256r1
      • Authentication algorithm: MILENAGE, TUAK, CAVE
    • Software standard compliancy
      • GSMA SGP.02 v3.2
      • SIMalliance interoperable profile v2.1
      • Java Card™ v3.0.4 Classic
      • GlobalPlatform® card specification v2.2, including GP amendments A, B, C, D and E
      • ETSI, 3GPP and 3GPP2 release 12 (for further information, contact your local STMicroelectronics sales office)
      • Power saving features (PSM and eDRX) defined by ETSI release 13
    • Certification
      • GlobalPlatform-certified "Muse eUICC-i2 v1" compliant with GSMA SGP.02 v3.2

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ST4SIM-200A
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DICE Not Applicable NEC - No availability of distributors reported, please contact our sales office

ST4SIM-200A

Marketing Status

Active

Unit Price (US$)

-

Approximate Price (US$)* / Qty

Package

DICE

Packing Type

Not Applicable

ECCN (EU)

NEC

Country of Origin

-

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

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00 Files selected for download

Technical Documentation

    • Description Version Size Action
      DB4080
      eSIM system-on-chip solution for automotive applications
      1.0
      265.29 KB
      PDF
      DB4080

      eSIM system-on-chip solution for automotive applications

Presentations & Training Material

    • Description Version Size Action
      Overview presentation of ST4SIM product family 1.0
      486.66 KB
      PDF

      Overview presentation of ST4SIM product family

Publications and Collaterals

    • Description Version Size Action
      ST4SIM secure solutions for cellular connectivity 1.0
      364.62 KB
      PDF

      ST4SIM secure solutions for cellular connectivity

    • Description Version Size Action
      Brochure Secure MCUs - Secure Solutions 1.2
      1.11 MB
      PDF
      ST’s solutions for mobile devices 2.0
      2.13 MB
      PDF

      Brochure Secure MCUs - Secure Solutions

      ST’s solutions for mobile devices

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
ST4SIM-200A
Active
DICE Industrial N/A

ST4SIM-200A

Package:

DICE

Material Declaration**:

Marketing Status

Active

Package

DICE

Grade

Industrial

RoHS Compliance Grade

N/A

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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