The ST54D is an all-in-one solution including NFC controller and Secure Element with the highest security level (EAL5+ and EMVCo certified hardware).
Fully manufactured in a secure environment, it provides the highest performance levels thanks to its ARM® SC300® core.
The 64-ball WFBGA (4 x 4 x 0.8 mm) ECOPACK® package provides a reduced footprint and pin-to-pin compatibility with the STMicroelectronics NFC standalone solution. There is no internal direct connection between the two devices inside the package.
A complete range of memory sizes from 128 to more than 600 Kbytes (depending on profile) is available on the Secure Element.
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK®packages, depending on their level of environmental compliance. ECOPACK®specifications, grade definitions and product status are available at: www.st.com. ECOPACK®is an ST trademark.
|DB2697: NFC controller and Secure Element system-in-package||1.0||136 KB|
|ST NFC enabled solutions||1.0||2 MB|
|Secure MCUs for mobile communications and M2M||2.3||540 KB|
|Brochure Secure MCUs Secure Solutions||1.2||2 MB|
|NFC solutions from ST||1.0||3 MB|
|ST’s solutions for mobile devices||2 MB|
|Part Number||Marketing Status||Quantity||Unit Price (US$) *||Package||Packing Type||ECCN (US)||Country of Origin||More info||Order from ST||Order from Distributors|
|ST54D||Active : Product is in volume production||-||-||CDIP 24 .610 S/B||Tube||5A002A1||-||MORE INFO||No availability reported, please contact our Sales office|
|Part Number||Marketing Status||Package||Grade||RoHS Compliance Grade||Material Declaration**|
|ST54D||Active||CDIP 24 .610 S/B||Industrial||N/A|
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.