Product overview
Description
The STPay-BlueAmb-23 is a GlobalPlatform® 2.2.1 Java Card™ platform for payment applications. With up to 95 Kbytes of user nonvolatile memory, the STPay-BlueAmb-23 can be configured to support AMEX® payment applications. It integrates a secure microcontroller that is based on an Arm® SecurCore® RISC core.The STPay System-on-Chip (SoC) family is a packaged offering by ST, comprising a highly secure microcontroller, embedded application software, tools and support aimed at serving the needs of card embedders and personalization bureaus worldwide.
For detailed configuration data, contact your local ST sales office.
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All features
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- Java Card™ platform
- Up to 95 Kbytes of user nonvolatile memory
- Certified payment applications: AMEX®
- Common Personalization Specification (CPS) personalization
- Platform
- Java Card™ 3.0.4 classic operating system
- GlobalPlatform® 2.2.1 MG 1.0.1 API support
- CPS-compliant
- ISO/IEC 7816 T = 0 or T = 1 contact interface
- Hardware
- 32-bit Arm® SecurCore® SC000™ ST31 secure microcontroller
- Up to 95 Kbytes of user NVM
- Cryptography
- NESCRYPT cryptographic RSA coprocessor
- Enhanced DES accelerator (EDES)
- Personalization
- Enhanced personalization performance for very fast personalization
- EMV® CPS v1.1 compliant
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All resources
| Resource title | Latest update |
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Product Specifications (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 04 Jun 2019 | 04 Jun 2019 |
Presentations (2)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 14 Aug 2020 | 14 Aug 2020 | |||
| 14 Apr 2021 | 14 Apr 2021 |
Flyers (3)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 26 Nov 2020 | 26 Nov 2020 | |||
| 23 Nov 2020 | 23 Nov 2020 | |||
| 23 Nov 2020 | 23 Nov 2020 |
Brochures (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 19 Mar 2021 | 19 Mar 2021 |
EDA Symbols, Footprints and 3D Models
STMicroelectronics - STPay-BlueAmb-23
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|---|
| STPAY-BLUEAMB-23 | Active | DICE | Industrial | N/A | |
STPAY-BLUEAMB-23
Package:
DICEMaterial Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Order from Distributors | Order from ST | Marketing Status | ECCN (US) | ECCN (EU) | Packing Type | Package | Temperature (°C) | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | |||||||||||
| STPAY-BLUEAMB-23 | No availability of distributors reported, please contact our sales office | Active | 3A991A2 | NEC | Not Applicable | DICE | - | - | FRANCE | |||
Marketing Status
ActiveECCN (US)
3A991A2(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
