Product overview
Description
The STPay-CPA is a GlobalPlatform® 2.2.1 Java Card™ platform for payment applications. With up to 115 Kbytes of user nonvolatile memory, the STPay-CPA is configured to support EMVCo Common Payment Application (CPA) payment applications both in Static data authentication (SDA) and Dynamic/Combined data authentication (DDA/CDA) configurations. It integrates a secure microcontroller that is based on an Arm® SecurCore® RISC core.The STPay System-on-Chip (SoC) family is a packaged offering by ST, comprising a highly secure microcontroller, embedded application software, tools and support aimed at serving the needs of card embedders and personalization bureaus worldwide.
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All features
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- Java Card™ platform
- Up to 115 Kbytes of user nonvolatile memory
- Certified payment application: EMVCo® Common Payment Application (CPA)
- Common Personalization Specification (CPS) personalization
- Platform
- Java Card™ 2.2.2 operating system
- GlobalPlatform® 2.2.1 MG 1.0.1 API support
- CPS-compliant
- ISO/IEC 7816 T = 0 contact interface
- Hardware
- 32-bit Arm® SecurCore® SC000™ ST31 secure microcontroller
- Up to 115 Kbytes of user NVM
- Cryptography
- NESCRYPT cryptographic RSA coprocessor
- Enhanced DES accelerator (EDES)
- Personalization
- EMV® CPS v1.1 compliant
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All resources
| Resource title | Latest update |
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Product Specifications (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 12 Mar 2019 | 12 Mar 2019 |
Presentations (2)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 14 Aug 2020 | 14 Aug 2020 | |||
| 14 Apr 2021 | 14 Apr 2021 |
Flyers (3)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 26 Nov 2020 | 26 Nov 2020 | |||
| 23 Nov 2020 | 23 Nov 2020 | |||
| 23 Nov 2020 | 23 Nov 2020 |
Brochures (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 19 Mar 2021 | 19 Mar 2021 |
EDA Symbols, Footprints and 3D Models
STMicroelectronics - STPay-CPA
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|---|
| STPAY-CPA | Active | DICE | Industrial | N/A | |
STPAY-CPA
Package:
DICEMaterial Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Order from Distributors | Order from ST | Marketing Status | ECCN (US) | ECCN (EU) | Packing Type | Package | Temperature (°C) | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | |||||||||||
| STPAY-CPA | No availability of distributors reported, please contact our sales office | Active | 3A991A2 | NEC | Not Applicable | DICE | - | - | FRANCE | |||
Marketing Status
ActiveECCN (US)
3A991A2(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
