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ST’s IPD process can integrate high-quality passive elements (resistors, inductors, capacitors) on glass and high resistivity silicon substrates in various design configurations.

ST IPD photo

Our standard product offering includes baluns, RF couplers, filters and diplexers.

BALUN

COUPLER

DIPLEXER

FILTER

We also support these IPs: combiners, triplexers, and impedance matching network.

Our IPD technology covers all RF applications with a frequency range from 168MHz and above, such as:

Sub-Giga

UWB

ZigBee

Bluetooth

 

Wi-Fi
2.4GHz & 5GHz

 

WiMax

4G

5G

and more

 

The key benefits of this technology are:

  • Superior process control over discrete solutions
  • competitive cost structure (Lower cost than GaAs and discrete solutions)
  • small form factor
    • Smaller area than discrete solutions
    • Thinner than LTCC
  • reduced power losses
  • Comprehensive design kit
  • Efficient design services
  • Fast foundry shuttle service

ST’s IPD products are compatible with different assembly modes including CSP, microbumping and wirebonding, to be mounted either on the main Printed Wiring Board (PWB) or inside a complete RF module.