-
The BAL-UWB-01E3 is an ultra-miniature balun that integrates matching network, dedicated to ultra-wide band 3 GHz to 8 GHz.
This device uses STMicroelectronics IPD technology on non conductive glass substrate which optimizes RF performance.
主な特徴
- Very low profile
- High RF performance
- PCB space saving
- Efficient manufacturability
- LGA footprint compatible
- Low thickness ≤ 450 µm
サンプル & 購入
| 製品型番 | パッケージ | 梱包タイプ | Minimum Sellable Quantity | 製品ステータス | 概算価格（USS） | Quantity | ECCN (US) | Country of Origin | 販売代理店からオーダー | STからオーダー |
|---|---|---|---|---|---|---|---|---|---|---|
| BAL-UWB-01E3 | FLIP CHIP BUMPLESS CSPG | Tape And Reel | 5000 | Active | 0.2135 | 500 | EAR99 | CHINA | 在庫チェック | 購入 |
(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
ビデオ
Smart Antenna Tuning with STMicroelectronics (all LTE bands)
Antenna desense medication with ECMF™ common-mode filters integrating ESD protection
STHVDAC, STPTIC: better sensitivity and longer battery life
| 製品型番 | 製品ステータス | パッケージ | グレード | RoHSコンプライアンスグレード | Material Declaration** |
|---|---|---|---|---|---|
| BAL-UWB-01E3 | Active | FLIP CHIP BUMPLESS CSPG | インダストリアル | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
