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This device is an ultra-miniature balun. The BALF-SPI2-01D3 integrates matching network and harmonics filter. Matching impedance has been customized for the ST S2-LP transceiver. The BALF-SPI2-01D3 uses STMicroelectronics IPD technology on non-conductive glass substrate which optimize RF performance.
主な特徴
- 50 Ω nominal input / conjugate matched to ST S2-LP for 860 - 930 MHz frequency operation
- Low insertion loss
- Low amplitude imbalance
- Low phase imbalance
- Small footprint
- Very low profile < 620 μm after reflow
- High RF performance
- RF BOM and area reduction
- ECOPACK®2 compliant component
サンプル & 購入
| 製品型番 | パッケージ | 梱包タイプ | Minimum Sellable Quantity | 製品ステータス | 概算価格（USS） | 数量 | ECCN (US) | Country of Origin | 販売代理店からオーダー | STからオーダー |
|---|---|---|---|---|---|---|---|---|---|---|
| BALF-SPI2-01D3 | Chip Scale Package 0.4mm pitch | Tape And Reel | 5000 |
アクティブ
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0.176 | 500 | EAR99 | CHINA | 在庫チェック | 購入 |
(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
ビデオ
Smart Antenna Tuning with STMicroelectronics (all LTE bands)
Antenna desense medication with ECMF™ common-mode filters integrating ESD protection
STHVDAC, STPTIC: better sensitivity and longer battery life
開発ツール･ハードウェア
開発環境
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写真 品名 製造元 概要 SIGFOX-MOD1-C XoverIoT The SIGFOX-MOD1 is a ultra-low-power module designed especially for sensor node applications mounted with chip antenna. SIGFOX-MOD1-E XoverIoT The SIGFOX-MOD1-E is an ultra-low-power module designed especially for sensor node applications. Same features as the SIGFOX-MOD1-C but with an U.FL connector for usage of external antennas. 製品型番The SIGFOX-MOD1 is a ultra-low-power module designed especially for sensor node applications mounted with chip antenna.
The SIGFOX-MOD1-E is an ultra-low-power module designed especially for sensor node applications. Same features as the SIGFOX-MOD1-C but with an U.FL connector for usage of external antennas.
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写真 品名 製造元 概要 
X-NUCLEO-S2868A1 ST Sub-1 GHz 868 MHz RF expansion board based on S2-LP radio for STM32 Nucleo 製品型番Sub-1 GHz 868 MHz RF expansion board based on S2-LP radio for STM32 Nucleo
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| 製品型番 | 製品ステータス | パッケージ | グレード | RoHSコンプライアンスグレード | 材料宣誓書** |
|---|---|---|---|---|---|
| BALF-SPI2-01D3 |
アクティブ
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Chip Scale Package 0.4mm pitch | インダストリアル | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
