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  • The EMIF03-SIM05F3 is a highly integrated device designed to protect SIM interface and SWP line against ESD transients and EMI emission.

    The device is the ideal fit for applications using NFC.

    主な特徴

    • Lead-free package
    • Very low PCB space consumption
    • Very thin package: < 0.55 mm after reflow
    • High efficiency in ESD suppression IEC6 1000-4-2 level 4
    • High reliability offered by monolithic integration
    • High reduction of parasitic elements through integration and WLCSP packaging
    • Complies with the following standards:
      • IEC 61000-4-2 level 4
        • ± 15 kV (air discharge)
        • ± 8 kV (contact discharge)

サンプル & 購入

製品型番
パッケージ
梱包タイプ
製品ステータス
概算価格(USS)
数量
ECCN (US)
Country of Origin
販売代理店からオーダー
STからオーダー
EMIF03-SIM05F3 Chip Scale Package 0.4mm pitch Tape And Reel
NRND
- - EAR99 - No availability of distributors reported, please contact our sales office

EMIF03-SIM05F3

パッケージ

Chip Scale Package 0.4mm pitch

梱包タイプ

Tape And Reel

Unit Price (US$)

*

製品ステータス

NRND

Unit Price (US$)

-

数量

-

ECCN (US)

EAR99

Country of Origin

-

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

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技術文書

    • 概要 バージョン サイズ アクション
      DS9085
      EMI filter with SWP protection for SIM interface
      1.0
      359.93 KB
      PDF
      DS9085

      EMI filter with SWP protection for SIM interface

    • 概要 バージョン サイズ アクション
      AN4541
      EMI filters for SD3.0 card high-speed SD card protection and filtering devices
      1.1
      1.13 MB
      PDF
      AN5241
      Fundamentals of ESD protection at system level
      1.1
      1.45 MB
      PDF
      AN3353
      IEC 61000-4-2 standard testing
      1.2
      171.08 KB
      PDF
      AN2348
      IPAD™ 400 µm Flip Chip: package description and recommendations for use
      5.0
      261.7 KB
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      AN1235
      IPAD™ 500 µm Flip Chip: package description and recommendations for use
      8.0
      251.82 KB
      PDF
      AN4541

      EMI filters for SD3.0 card high-speed SD card protection and filtering devices

      AN5241

      Fundamentals of ESD protection at system level

      AN3353

      IEC 61000-4-2 standard testing

      AN2348

      IPAD™ 400 µm Flip Chip: package description and recommendations for use

      AN1235

      IPAD™ 500 µm Flip Chip: package description and recommendations for use

    • 概要 バージョン サイズ アクション
      TN1173
      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches
      6.0
      444.57 KB
      PDF
      TN1173

      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches

HWモデル、CADライブラリ & SVD

    • 概要 バージョン サイズ アクション
      emif03-sim05f3 OrCad Symbol and Footprint files 1.0
      13.9 KB
      ZIP

      emif03-sim05f3 OrCad Symbol and Footprint files

製品型番 製品ステータス パッケージ グレード RoHSコンプライアンスグレード 材料宣誓書**
EMIF03-SIM05F3
NRND
Chip Scale Package 0.4mm pitch インダストリアル Ecopack2

EMIF03-SIM05F3

Package:

Chip Scale Package 0.4mm pitch

Material Declaration**:

PDF XML

Marketing Status

NRND

Package

Chip Scale Package 0.4mm pitch

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.