製品概要

概要

The EMIF06-VID01F2 is a 6-line highly integrated array designed to suppress EMI / RFI noise in all systems subjected to electromagnetic interference. The EMIF06-VID01F2 Flip Chip packaging means the package size is equal to the die size.
Additionally, this filter includes ESD protection circuitry which prevents damage to the protected device when subjected to ESD surges up to 15 kV.

特徴
High efficiency in ESD suppression on inputs pins (IEC 61000-4-2 level 4)

Very thin package: 0.65 mm

High reduction of parasitic elements through integration and wafer level packaging

High efficiency EMI filtering (-40 dB @ 900 MHz)

Low serial resistance for camera impedance adaptation

Low line capacitance suitable for high speed data bus

Optimized PCB space occupation: 2.92 mm x 1.29 mm

High reliability offered by monolithic integration

Lead-free package
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注目ビデオ

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All resources

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	Resource title		Latest update

製品スペック (1)

	Resource title		Latest update
PDF	DS4228 6-line IPAD™, low capacitance EMI filter and ESD protection 2.1		19 Sep 2016	19 Sep 2016 DS4228 6-line IPAD™, low capacitance EMI filter and ESD protection 2.1

アプリケーションノート (4)

	Resource title	Latest update
PDF	AN5241 Fundamentals of ESD protection at system level 1.1	06 Aug 2019	06 Aug 2019 AN5241 Fundamentals of ESD protection at system level 1.1
PDF	AN3353 IEC 61000-4-2 standard testing 1.2	24 Mar 2020	24 Mar 2020 AN3353 IEC 61000-4-2 standard testing 1.2
PDF	AN2348 IPAD™ 400 µm Flip Chip: package description and recommendations for use 5.0	13 Sep 2018	13 Sep 2018 AN2348 IPAD™ 400 µm Flip Chip: package description and recommendations for use 5.0
PDF	AN1235 IPAD™ 500 µm Flip Chip: package description and recommendations for use 8.0	22 Sep 2015	22 Sep 2015 AN1235 IPAD™ 500 µm Flip Chip: package description and recommendations for use 8.0

技術ノート & 解説 (2)

	Resource title		Latest update
PDF	TA0318 EMI and ESD consideration for LCD and cameras in wireless handsets 1.2		15 Feb 2013	15 Feb 2013 TA0318 EMI and ESD consideration for LCD and cameras in wireless handsets 1.2
PDF	TN1173 Packing information for IPAD, protection, rectifiers, thyristors and AC Switches 8.0		25 Aug 2020	25 Aug 2020 TN1173 Packing information for IPAD, protection, rectifiers, thyristors and AC Switches 8.0

EDA Symbols, Footprints and 3D Models

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	Resource title		Latest update

CAD Symbol & Footprint models (1)

	Resource title		Latest update
ZIP	emif06-vid01f2 OrCad Symbol and Footprint files 1.2		18 Mar 2020	18 Mar 2020 emif06-vid01f2 OrCad Symbol and Footprint files 1.2

品質 & 信頼性

製品型番	Marketing Status	パッケージ	グレード	RoHSコンプライアンスグレード	材料宣誓書**
EMIF06-VID01F2	量産中	CSP P 0.5 mm	インダストリアル	Ecopack2	PDF

EMIF06-VID01F2

Package:

CSP P 0.5 mm

Material Declaration**:

PDF

More Info

(**) st.comで提供している材料宣誓書は、パッケージ･ファミリ内で最も一般的に使用されているパッケージに基づく汎用ドキュメントの場合があります。そのため、特定の製品では100%正確ではない可能性があります。特定の製品情報については、セールスサポートまでお問い合わせください

サンプル & 購入

	製品型番	販売代理店から購入	STから購入	製品ステータス	ECCN (US)	ECCN (EU)	梱包タイプ	パッケージ	温度（℃）		Country of Origin	Budgetary Price (US$)*/Qty
	製品型番	販売代理店から購入	STから購入	製品ステータス	ECCN (US)	ECCN (EU)	梱包タイプ	パッケージ	最小	最大	Country of Origin	Budgetary Price (US$)*/Qty
	EMIF06-VID01F2	販売代理店に在庫がない場合は、STのセールス･オフィスまでお問い合わせください		量産中	EAR99	NEC	Tape And Reel	CSP P 0.5 mm	-	-	FRANCE