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主な特徴
- ECOPACK® compliant (see Section 9)
- High shock survivability
- Programmable 12 or 16 bit data representation
- Programmable interrupt threshold
- 2.16V to 3.6V single supply operation
- I2C/SPI digital output interfaces
- 1.8V compatible IOs
- Interrupt activated by motion
- Embedded self test
ダウンロード
サンプル & 購入
| 製品型番 | パッケージ | Packing Type | Marketing Status | Budgetary Price (US$)* | 数量 | ECCN (US) | Country of Origin | Order from Distributors | Order from ST |
|---|---|---|---|---|---|---|---|---|---|
| LIS3LV02DLTR | LGA 16 4.4x7.5x1.0 | Tape And Reel |
Active
|
4.24 | 1000 | EAR99 | - | Check Availability | Buy direct |
| LIS3LV02DL | LGA 16 4.4x7.5x1.0 | Tray |
Active
|
4.24 | 1000 | EAR99 | - | Check Availability |
LIS3LV02DL
パッケージ
LGA 16 4.4x7.5x1.0Packing Type
TrayUnit Price (US$)
4.24*(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
開発環境
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写真 Part number 製造元 Description AWS IoT Core AWS AWS IoT Core is a managed cloud platform that lets connected devices easily and securely interact with cloud applications and other devices. AZURE Cloud Microsoft Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks. Watson IoT Platform IBM IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices. 製品型番AWS IoT Core is a managed cloud platform that lets connected devices easily and securely interact with cloud applications and other devices.
Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks.
IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices.
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写真 Part number 製造元 Description SensiBLE SensiEDGE Ready-to-use BLE System-on-Module packed with sensors, low power ARM® 32-bit Cortex®-M4 CPU and coin battery. Speed up IoT product development today! SensiSUB SensiEDGE Connecting low-power SUB 1GHZ RF transceiver to the Cloud with fully customisable sensors, ARM® 32-bit Cortex®-M4 CPU and coin battery. 製品型番Ready-to-use BLE System-on-Module packed with sensors, low power ARM® 32-bit Cortex®-M4 CPU and coin battery. Speed up IoT product development today!
Connecting low-power SUB 1GHZ RF transceiver to the Cloud with fully customisable sensors, ARM® 32-bit Cortex®-M4 CPU and coin battery.
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ソフトウェア製品
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写真 Part number 製造元 Description AndroidHAL-IIO ST Android sensor HAL for MEMS motion and environmental sensors (Industrial I/O framework) LinuxDriverIIO ST Linux device drivers for MEMS motion and environmental sensors (Industrial I/O framework) 製品型番Android sensor HAL for MEMS motion and environmental sensors (Industrial I/O framework)
Linux device drivers for MEMS motion and environmental sensors (Industrial I/O framework)
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Support and Applications
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写真 Part number 製造元 Description Hardware and firmware design SIANA Systems Complete hardware and firmware design for all applications SensiEDGE customization services SensiEDGE End-to-end development services: Hardware, Firmware, Software development, Enclosure, Cloud and mobile APPs. Speed up your IoT project with SensiEDGE! SensorTile.box customization services FAE Technology Engineering services on theSensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing. 製品型番Complete hardware and firmware design for all applications
End-to-end development services: Hardware, Firmware, Software development, Enclosure, Cloud and mobile APPs. Speed up your IoT project with SensiEDGE!
Engineering services on theSensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing.
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| 製品型番 | Marketing Status | パッケージ | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|
| LIS3LV02DL |
Active
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LGA 16 4.4x7.5x1.0 | Ecopack2 | |
| LIS3LV02DLTR |
Active
|
LGA 16 4.4x7.5x1.0 | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
