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The LSM6DS3 is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 1.25 mA (up to 1.6 kHz ODR) in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.
The LSM6DS3 supports main OS requirements, offering real, virtual and batch sensors with 8 kbyte for dynamic data batching.
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.
The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
The LSM6DS3 has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
High robustness to mechanical shock makes the LSM6DS3 the preferred choice of system designers for the creation and manufacturing of reliable products.
The LSM6DS3 is available in a plastic land grid array (LGA) package.Key Features
- Power consumption: 0.9 mA in combo normal mode and 1.25 mA in combo high-performance mode up to 1.6 kHz.
- “Always-on” experience with low power consumption for both accelerometer and gyroscope
- Smart FIFO up to 8 kbyte based on features set
- Compliant with Android K and L
- Hard, soft ironing for external magnetic sensor corrections
- ±2/±4/±8/±16 g full scale
- ±125/±250/±500/±1000/±2000 dps full scale
- Analog supply voltage: 1.71 V to 3.6 V
- Independent IOs supply (1.62 V)
- Compact footprint, 2.5 mm x 3 mm x 0.83 mm
- SPI/I2C serial interface with main processor data synchronization feature
- Embedded temperature sensor
- ECOPACK®, RoHS and “Green” compliant
サンプル & 購入
| 製品型番 | パッケージ | 梱包タイプ | 製品ステータス | 概算価格（USS） | 数量 | ECCN (US) | Country of Origin | 販売代理店からオーダー | STからオーダー |
|---|---|---|---|---|---|---|---|---|---|
| LSM6DS3TR | VFLGA 2.5X3X0.86 14L | Tape And Reel |
アクティブ
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1.771 | 1000 | EAR99 | - | 在庫チェック | サンプル入手 |
| LSM6DS3 | VFLGA 2.5X3X0.86 14L | Tray |
プレビュー
|
- | - | EAR99 | - | 販売代理店に在庫がない場合は、STのセールスオフィスまでお問い合わせください |
LSM6DS3
パッケージ
VFLGA 2.5X3X0.86 14L梱包タイプ
TrayUnit Price (US$)
*(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
ビデオ
A bridge between the sensor on the motherboard and your laptop
開発環境
ソフトウェア製品
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写真 Part number 製造元 概要 
X-CUBE-MEMS-XT1 ST Sensor and DSP algorithm software expansion for STM32Cube 
X-CUBE-MEMS1 ST Sensor and motion algorithm software expansion for STM32Cube 製品型番Sensor and DSP algorithm software expansion for STM32Cube
Sensor and motion algorithm software expansion for STM32Cube
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写真 Part number 製造元 概要 AndroidHAL-IIO ST Android sensor HAL for MEMS motion and environmental sensors (Industrial I/O framework) AndroidHALInput ST Android sensor HAL for MEMS motion and environmental sensors (Input framework) C-Driver-MEMS ST Standard C platform-independent drivers for MEMS motion and environmental sensors LinuxDriverIIO ST Linux device drivers for MEMS motion and environmental sensors (Industrial I/O framework) LinuxDriverInput ST Linux device drivers for MEMS motion and environmental sensors (Input framework) 製品型番Android sensor HAL for MEMS motion and environmental sensors (Industrial I/O framework)
Android sensor HAL for MEMS motion and environmental sensors (Input framework)
Standard C platform-independent drivers for MEMS motion and environmental sensors
Linux device drivers for MEMS motion and environmental sensors (Industrial I/O framework)
Linux device drivers for MEMS motion and environmental sensors (Input framework)
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評価ツール
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写真 Part number 製造元 概要 
STEVAL-MKI160V1 ST LSM6DS3 adapter board for standard DIL24 socket 製品型番LSM6DS3 adapter board for standard DIL24 socket
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写真 Part number 製造元 概要 
STEVAL-WESU1 ST Wearable sensor unit reference design for fast time to market 製品型番Wearable sensor unit reference design for fast time to market
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サポート & アプリケーション
| 製品型番 | 製品ステータス | パッケージ | RoHSコンプライアンスグレード | Material Declaration** |
|---|---|---|---|---|
| LSM6DS3 |
プレビュー
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VFLGA 2.5X3X0.86 14L | Ecopack2 |
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| LSM6DS3TR |
アクティブ
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VFLGA 2.5X3X0.86 14L | Ecopack2 |
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LSM6DS3
Package:
VFLGA 2.5X3X0.86 14LMaterial Declaration**:
LSM6DS3TR
Package:
VFLGA 2.5X3X0.86 14LMaterial Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
