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The LSM6DS3 is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 1.25 mA (up to 1.6 kHz ODR) in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.
The LSM6DS3 supports main OS requirements, offering real, virtual and batch sensors with 8 kbyte for dynamic data batching.
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.
The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
The LSM6DS3 has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
High robustness to mechanical shock makes the LSM6DS3 the preferred choice of system designers for the creation and manufacturing of reliable products.
The LSM6DS3 is available in a plastic land grid array (LGA) package.主な特徴
- Power consumption: 0.9 mA in combo normal mode and 1.25 mA in combo high-performance mode up to 1.6 kHz.
- “Always-on” experience with low power consumption for both accelerometer and gyroscope
- Smart FIFO up to 8 kbyte based on features set
- Compliant with Android K and L
- Hard, soft ironing for external magnetic sensor corrections
- ±2/±4/±8/±16 g full scale
- ±125/±250/±500/±1000/±2000 dps full scale
- Analog supply voltage: 1.71 V to 3.6 V
- Independent IOs supply (1.62 V)
- Compact footprint, 2.5 mm x 3 mm x 0.83 mm
- SPI/I2C serial interface with main processor data synchronization feature
- Embedded temperature sensor
- ECOPACK®, RoHS and “Green” compliant
ビデオ
This video tutorial shows how to easily configure a silicon-embedded advanced pedometer feature, using ST’s new generation of iNEMO™ Inertial Measurement Units (IMU).
This video on the SensorTile.box Pro Mode shows you how to use this IoT and wearable sensor development kit to create customized wireless applications using an STM32Cube function pack. Use-case on a Human Activity Recognition algorithm included.
開発環境
ソフトウェア製品
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画像 製品型番 製造者 概要 
X-CUBE-MEMS-XT1 ST Sensor and DSP algorithm software expansion for STM32Cube 
X-CUBE-MEMS1 ST Sensor and motion algorithm software expansion for STM32Cube 製品型番Sensor and DSP algorithm software expansion for STM32Cube
Sensor and motion algorithm software expansion for STM32Cube
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画像 製品型番 製造者 概要 AndroidHAL-IIO ST Android sensor HAL for MEMS motion and environmental sensors (Industrial I/O framework) AndroidHALInput ST Android sensor HAL for MEMS motion and environmental sensors (Input framework) C-Driver-MEMS ST Standard C platform-independent drivers for MEMS motion and environmental sensors LinuxDriverIIO ST Linux device drivers for MEMS motion and environmental sensors (Industrial I/O framework) LinuxDriverInput ST Linux device drivers for MEMS motion and environmental sensors (Input framework) 製品型番Android sensor HAL for MEMS motion and environmental sensors (Industrial I/O framework)
Android sensor HAL for MEMS motion and environmental sensors (Input framework)
Standard C platform-independent drivers for MEMS motion and environmental sensors
Linux device drivers for MEMS motion and environmental sensors (Industrial I/O framework)
Linux device drivers for MEMS motion and environmental sensors (Input framework)
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評価ツール
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画像 製品型番 製造者 概要 
STEVAL-MKI160V1 ST LSM6DS3 adapter board for standard DIL24 socket 製品型番LSM6DS3 adapter board for standard DIL24 socket
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画像 製品型番 製造者 概要 
STEVAL-WESU1 ST Wearable sensor unit reference design for fast time to market 製品型番Wearable sensor unit reference design for fast time to market
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サポート & アプリケーション
品質 & 信頼性
| 製品型番 | Marketing Status | パッケージ | RoHSコンプライアンスグレード | 材料宣誓書** |
|---|---|---|---|---|
| LSM6DS3 | 開発中 | VFLGA 2.5X3X0.86 14L | Ecopack2 | |
| LSM6DS3TR | 量産中 | VFLGA 2.5X3X0.86 14L | Ecopack2 | |
LSM6DS3
Package:
VFLGA 2.5X3X0.86 14LMaterial Declaration**:
LSM6DS3TR
Package:
VFLGA 2.5X3X0.86 14LMaterial Declaration**:
(**) st.comで提供している材料宣誓書は、パッケージ･ファミリ内で最も一般的に使用されているパッケージに基づく汎用ドキュメントの場合があります。そのため、特定の製品では100%正確ではない可能性があります。特定の製品情報については、セールスサポートまでお問い合わせください
サンプル & 購入
| 製品型番 | 販売代理店からオーダー | STからオーダー | 製品ステータス | ECCN (US) | ECCN (EU) | 梱包タイプ | パッケージ | 温度（℃） | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小 | 最大 | |||||||||||
| LSM6DS3TR | 3 distributors | 量産中 | EAR99 | NEC | Tape And Reel | VFLGA 2.5X3X0.86 14L | -40 | 85 | PHILIPPINES | 1.771 / 1k | ||
| LSM6DS3 | 販売代理店に在庫がない場合は、STのセールスオフィスまでお問い合わせください | 開発中 | EAR99 | NEC | Tray | VFLGA 2.5X3X0.86 14L | -40 | 85 | THAILAND | |||
製品ステータス
量産中ECCN (US)
EAR99Budgetary Price (US$)*/Qty
1.771 / 1k製品ステータス
開発中ECCN (US)
EAR99Budgetary Price (US$)*/Qty
（*）概算用の希望小売単価（US$）です。現地通貨でのお見積りについては、STのセールス･オフィスまたは販売代理店までお問い合わせください。
