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The LSM6DS3H is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 1.1 mA (up to 1.6 kHz ODR) in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.
The LSM6DS3H supports main OS requirements, offering real, virtual and batch sensors with 4 kbyte FIFO + flexible 4 kbyte (FIFO or programmable) for dynamic data batching.
The LSM6DS3H gyroscope supports both OIS/EIS applications. The device can be connected to the camera module through a dedicated auxiliary SPI (Mode 3) while flexibility for the primary interface is available (I2C/SPI).
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.
The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
The LSM6DS3H has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±245/±500/±1000/±2000 dps.
High robustness to mechanical shock makes the LSM6DS3H the preferred choice of system designers for the creation and manufacturing of reliable products.
The LSM6DS3H is available in a plastic land grid array (LGA) package.特徴
- Power consumption: 0.85 mA in combo normal mode and 1.1 mA in combo high-performance mode up to 1.6 kHz.
- “Always-on” experience with low power consumption for both accelerometer and gyroscope
- Interface flexibility: selectable SPI (3/4-wire) or I2C with the main processor
- Auxiliary SPI (3-wire) to support OIS applications
- EIS/OIS support
- Accelerometer ODR up to 6.66 kHz
- Gyroscope ODR up to 3.33 kHz
- Smart FIFO
- ±2/±4/±8/±16 g full scale
- ±125/±245/±500/±1000/±2000 dps full scale
- Analog supply voltage: 1.71 V to 3.6 V
- Independent IOs supply (1.62 V)
- Compact footprint, 2.5 mm x 3 mm x 0.83 mm
- SPI/I2C serial interface data synchronization feature
- Embedded temperature sensor
- ECOPACK®, RoHS and “Green” compliant
注目ビデオ
This video tutorial shows how to easily configure a silicon-embedded advanced pedometer feature, using ST’s new generation of iNEMO™ Inertial Measurement Units (IMU).
This video on the SensorTile.box Pro Mode shows you how to use this IoT and wearable sensor development kit to create customized wireless applications using an STM32Cube function pack. Use-case on a Human Activity Recognition algorithm included.
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EDA Symbols, Footprints and 3D Models
品質 & 信頼性
製品型番 | Marketing Status | パッケージ | RoHSコンプライアンスグレード | 材料宣誓書** |
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LSM6DS3HTR |
NRND
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VFLGA 2.5X3X0.86 14L | Ecopack2 |
(**) st.comで提供している材料宣誓書は、パッケージ・ファミリ内で最も一般的に使用されているパッケージに基づく汎用ドキュメントの場合があります。そのため、特定の製品では100%正確ではない可能性があります。特定の製品情報については、セールスサポートまでお問い合わせください
サンプル & 購入
製品型番 | 販売代理店からオーダー | STからオーダー | 製品ステータス | ECCN (US) | ECCN (EU) | 梱包タイプ | パッケージ | 温度(℃) | Country of Origin | Budgetary Price (US$)*/Qty | ||
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LSM6DS3HTR | 1 distributors |
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EAR99 | NEC | Tape And Reel | VFLGA 2.5X3X0.86 14L | -40 | 85 | THAILAND | 2.093 / 1k |
製品ステータス
NRNDECCN (US)
EAR99Budgetary Price (US$)*/Qty
2.093 / 1k(*)概算用の希望小売単価(US$)です。現地通貨でのお見積りについては、STのセールス・オフィスまたは販売代理店までお問い合わせください。