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LSM6DS3H

NRND
MySTに保存

iNEMO 6DoF inertial measurement unit (IMU) supporting OIS / EIS application

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製品概要

概要

The LSM6DS3H is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 1.1 mA (up to 1.6 kHz ODR) in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer. The LSM6DS3H supports main OS requirements, offering real, virtual and batch sensors with 4 kbyte FIFO + flexible 4 kbyte (FIFO or programmable) for dynamic data batching.
The LSM6DS3H gyroscope supports both OIS/EIS applications. The device can be connected to the camera module through a dedicated auxiliary SPI (Mode 3) while flexibility for the primary interface is available (I2C/SPI).
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.
The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
The LSM6DS3H has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±245/±500/±1000/±2000 dps.
High robustness to mechanical shock makes the LSM6DS3H the preferred choice of system designers for the creation and manufacturing of reliable products.
The LSM6DS3H is available in a plastic land grid array (LGA) package.

  • 特徴

    • Power consumption: 0.85 mA in combo normal mode and 1.1 mA in combo high-performance mode up to 1.6 kHz.
    • “Always-on” experience with low power consumption for both accelerometer and gyroscope
    • Interface flexibility: selectable SPI (3/4-wire) or I2C with the main processor
    • Auxiliary SPI (3-wire) to support OIS applications
    • EIS/OIS support
    • Accelerometer ODR up to 6.66 kHz
    • Gyroscope ODR up to 3.33 kHz
    • Smart FIFO
    • ±2/±4/±8/±16 g full scale
    • ±125/±245/±500/±1000/±2000 dps full scale
    • Analog supply voltage: 1.71 V to 3.6 V
    • Independent IOs supply (1.62 V)
    • Compact footprint, 2.5 mm x 3 mm x 0.83 mm
    • SPI/I2C serial interface data synchronization feature
    • Embedded temperature sensor
    • ECOPACK®, RoHS and “Green” compliant
    続きを読む 一部を表示

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All resources

Expand all categories
Resource title
Latest update

製品スペック (1)

Resource title
Latest update
DS11273 iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope 5.0
02 Oct 2017
02 Oct 2017
DS11273 iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope 5.0

アプリケーションノート (1)

Resource title
Latest update
AN4844 LSM6DS3H: always-on 3D accelerometer and 3D gyroscope 4.0
25 Jan 2018
25 Jan 2018
AN4844 LSM6DS3H: always-on 3D accelerometer and 3D gyroscope 4.0

技術ノート & 解説 (1)

Resource title
Latest update
TN0018 Surface mounting guidelines for MEMS sensors in an LGA package 6.2
18 Jan 2021
18 Jan 2021
TN0018 Surface mounting guidelines for MEMS sensors in an LGA package 6.2

Design Notes & Tips (5)

Resource title
Latest update
DT0105 1-point or 3-point tumble sensor calibration 1.1
21 Jan 2021
21 Jan 2021
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DT0058 Computing tilt measurement and tilt-compensated eCompass 3.0
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08 Jan 2021
DT0058 Computing tilt measurement and tilt-compensated eCompass 3.0
DT0060 Exploiting the gyroscope to update tilt measurement and eCompass 3.0
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DT0060 Exploiting the gyroscope to update tilt measurement and eCompass 3.0
DT0064 Noise analysis and identification in MEMS sensors, Allan, Time, Hadamard, Overlapping, Modified, Total variance 1.0
19 Mar 2021
19 Mar 2021
DT0064 Noise analysis and identification in MEMS sensors, Allan, Time, Hadamard, Overlapping, Modified, Total variance 1.0
DT0106 Residual linear acceleration by gravity subtraction to enable dead-reckoning 1.1
21 Jan 2021
21 Jan 2021
DT0106 Residual linear acceleration by gravity subtraction to enable dead-reckoning 1.1

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Resource title
Latest update
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13 Jan 2021
13 Jan 2021
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EDA Symbols, Footprints and 3D Models

STMicroelectronics - LSM6DS3H

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

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品質 & 信頼性

製品型番 Marketing Status パッケージ RoHSコンプライアンスグレード 材料宣誓書**
LSM6DS3HTR
NRND
VFLGA 2.5X3X0.86 14L Ecopack2

LSM6DS3HTR

Package:

VFLGA 2.5X3X0.86 14L

Material Declaration**:

PDF XML
More Info

Marketing Status

NRND

Package

VFLGA 2.5X3X0.86 14L

RoHS Compliance Grade

Ecopack2

(**) st.comで提供している材料宣誓書は、パッケージ･ファミリ内で最も一般的に使用されているパッケージに基づく汎用ドキュメントの場合があります。そのため、特定の製品では100%正確ではない可能性があります。特定の製品情報については、セールスサポートまでお問い合わせください

サンプル & 購入

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ECCN (EU)
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最小
最大
LSM6DS3HTR Available at 1 distributors

販売代理店在庫LSM6DS3HTR

販売代理店
地域 在庫 最小発注数量 パートナー企業リンク
Newark Element14 AMERICA 500 0 発注する

販売代理店在庫データ: 2021-05-06

販売代理店

Newark Element14

在庫

500

Min.Order

0

地域

AMERICA 発注する

販売代理店在庫データ: 2021-05-06

NRND
EAR99 NEC Tape And Reel VFLGA 2.5X3X0.86 14L -40 85 THAILAND 2.093 / 1k

LSM6DS3HTR

製品ステータス

NRND

ECCN (US)

EAR99
詳細情報

Budgetary Price (US$)*/Qty

2.093 / 1k

販売代理店在庫LSM6DS3HTR

販売代理店
地域 在庫 最小発注数量 パートナー企業リンク
Newark Element14 AMERICA 500 0 発注する

販売代理店在庫データ: 2021-05-06

販売代理店

Newark Element14

在庫

500

Min.Order

0

地域

AMERICA 発注する

販売代理店在庫データ: 2021-05-06

ECCN (EU)

NEC

梱包タイプ

Tape And Reel

パッケージ

VFLGA 2.5X3X0.86 14L

Operating Temperature (°C)

(最小)

-40

(最大)

85

Budgetary Price (US$)* / Qty

2.093 / 1k

Country of Origin

THAILAND

（*）概算用の希望小売単価（US$）です。現地通貨でのお見積りについては、STのセールス･オフィスまたは販売代理店までお問い合わせください。

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