LSM6DS3US

NRND

iNEMO 6DoF inertial measurement unit (IMU), specifically designed for PC. It includes 8kB FIFO (4kB programmable)

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製品概要

概要

The LSM6DS3US is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 1.1 mA (up to 1.6 kHz ODR) in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer. The LSM6DS3US supports main OS requirements, offering real, virtual and batch sensors with 4 kbyte FIFO + flexible 4 kbyte (FIFO or programmable) for dynamic data batching.
The LSM6DS3US gyroscope supports both OIS/EIS applications. The device can be connected to the camera module through a dedicated auxiliary SPI (Mode 3) while flexibility for the primary interface is available (I2C/SPI).
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.
The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
The LSM6DS3US has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
High robustness to mechanical shock makes the LSM6DS3US the preferred choice of system designers for the creation and manufacturing of reliable products.
The LSM6DS3US is available in a plastic land grid array (LGA) package.
  • 特徴

    • Power consumption: 0.85 mA in combo normal mode and 1.1 mA in combo high-performance mode up to 1.6 kHz.
    • “Always-on” experience with low power consumption for both accelerometer and gyroscope
    • Interface flexibility: selectable SPI (3/4-wire) or I2C with the main processor
    • Auxiliary SPI (3-wire) to support OIS applications
    • EIS/OIS support
    • Accelerometer ODR up to 6.66 kHz
    • Gyroscope ODR up to 3.33 kHz
    • Smart FIFO
    • ±2/±4/±8/±16 g full scale
    • ±125/±250/±500/±1000/±2000 dps full scale
    • Analog supply voltage: 1.71 V to 3.6 V
    • Independent IOs supply (1.62 V)
    • Compact footprint, 2.5 mm x 3 mm x 0.83 mm
    • SPI/I2C serial interface data synchronization feature
    • Embedded temperature sensor
    • ECOPACK®, RoHS and “Green” compliant

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EDA Symbols, Footprints and 3D Models

STMicroelectronics - LSM6DS3US

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

Symbols

Symbols

Footprints

Footprints

3D model

3D models

品質 & 信頼性

製品型番 Marketing Status パッケージ RoHSコンプライアンスグレード 材料宣誓書**
LSM6DS3USTR
NRND
VFLGA 2.5X3X0.86 14L Ecopack2

LSM6DS3USTR

Package:

VFLGA 2.5X3X0.86 14L

Material Declaration**:

PDF XML

Marketing Status

NRND

Package

VFLGA 2.5X3X0.86 14L

RoHS Compliance Grade

Ecopack2

(**) st.comで提供している材料宣誓書は、パッケージ・ファミリ内で最も一般的に使用されているパッケージに基づく汎用ドキュメントの場合があります。そのため、特定の製品では100%正確ではない可能性があります。特定の製品情報については、セールスサポートまでお問い合わせください

サンプル & 購入

製品型番
販売代理店から購入
STから購入
製品ステータス
ECCN (US)
ECCN (EU)
梱包タイプ
パッケージ
温度(℃) Country of Origin
Budgetary Price (US$)*/Qty
最小
最大
LSM6DS3USTR

販売代理店に在庫がない場合は、STのセールス・オフィスまでお問い合わせください

NRND
EAR99 NEC Tape And Reel VFLGA 2.5X3X0.86 14L -40 85 PHILIPPINES

LSM6DS3USTR

製品ステータス

NRND

ECCN (US)

EAR99

Budgetary Price (US$)*/Qty

ECCN (EU)

NEC

梱包タイプ

Tape And Reel

パッケージ

VFLGA 2.5X3X0.86 14L

Operating Temperature (°C)

(最小)

-40

(最大)

85

Budgetary Price (US$)* / Qty

Country of Origin

PHILIPPINES

(*)概算用の希望小売単価(US$)です。現地通貨でのお見積りについては、STのセールス・オフィスまたは販売代理店までお問い合わせください。