SMART ICT represents the latest technology in embedded testing based on ProMik bootloader know-how and offers, in addition to Flash programming, multiple testing capabilities based on standardized hardware and software components.
SMART ICT is an inside-out approach to In-Circuit Testing. A SMART ICT bootloader running on the main MCU of the target PCB can test if components and modules are correctly placed and functioning, without the need for physical connection via test pads.
- High-Speed parallel testing
- Testing despite limited access to test pads
- Flexible solution with highest usability
- Testing at the physical limit of the component
- Significant test time savings through parallelization
- Testing of Non-Boundary Scan capable devices
- Execution of functional test via MCU
- Rest-Bus simulation
- Test of communication lines like Ethernet T100-Base, CAN-FD, CAN
- Flexible test functions
- Support of Boundary Scan tests