製品概要
概要
The HSP031-1BM6 is a single channel ESD array with a rail to rail architecture designed to protect 2 differential lines from over voltages event caused by ESD, surge (8/20 µs). Packaged in a QFN-6L, the device is designed specifically for the protection of high-speed differential lines such as Ethernet 10 Gbps.-
特徴
- High ESD protection level exceeding IEC 61000-4-2 level 4:
- ±30kV (contact discharge)
- ±30kV (air discharge)
- High IEC 61000-4-5 surge capability: 10 A
- Very low dynamic resistance: 0.25 Ohm
- Low capacitance: 0.7 pF
- High ESD protection level exceeding IEC 61000-4-2 level 4:
注目ビデオ
During this one-hour webinar, you will learn how to make your electronic system more robust against destructive Electrostatic Discharges (ESD) by using ST ESD Protection components. During this webinar you will learn about: - ESD major root causes and EMC standards - ST ESD Protections, which can help to protect your application againts ESD - Many real application examples demonstrating where protections play an important role - How to select the best protection for your usecases
In this video, we explain why it is important to protect against electrostatic discharges. We give a quick demonstration to show exactly what happens when you shoot at a microcontroller with an ESD gun!
ESDCAN01-2BLY with up to 30 kV ESD and overvoltage protection, with high surge capability at high temperature
All tools & software
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製品スペック (1)
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| 03 Jun 2020 | 03 Jun 2020 |
アプリケーションノート (4)
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| 06 Aug 2019 | 06 Aug 2019 | |||
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| 14 Dec 2015 | 14 Dec 2015 | |||
| 13 Sep 2018 | 13 Sep 2018 |
技術ノート & 解説 (2)
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| 09 Dec 2020 | 09 Dec 2020 | |||
| 25 Aug 2020 | 25 Aug 2020 |
プレゼンテーション (4)
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| 18 Nov 2019 | 18 Nov 2019 | |||
| 14 Apr 2021 | 14 Apr 2021 | |||
| 18 Dec 2015 | 18 Dec 2015 | |||
| 18 May 2015 | 18 May 2015 |
フライヤ (2)
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| 09 Apr 2021 | 09 Apr 2021 | |||
| 09 Apr 2021 | 09 Apr 2021 |
パンフレット (1)
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| 14 Apr 2021 | 14 Apr 2021 |
EDA Symbols, Footprints and 3D Models
STMicroelectronics - HSP031-1BM6
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
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CAD Symbol & Footprint models (1)
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| ZIP | 06 Jan 2021 | 06 Jan 2021 |
品質 & 信頼性
| 製品型番 | Marketing Status | パッケージ | グレード | RoHSコンプライアンスグレード | 材料宣誓書** |
|---|---|---|---|---|---|
| HSP031-1BM6 | 量産中 | QFN-6L | インダストリアル | Ecopack2 |
(**) st.comで提供している材料宣誓書は、パッケージ･ファミリ内で最も一般的に使用されているパッケージに基づく汎用ドキュメントの場合があります。そのため、特定の製品では100%正確ではない可能性があります。特定の製品情報については、セールスサポートまでお問い合わせください
サンプル & 購入
| 製品型番 | 販売代理店から購入 | STから購入 | 製品ステータス | ECCN (US) | ECCN (EU) | 梱包タイプ | パッケージ | 温度（℃） | Breakdown Voltage (V) (min) | Directionality | Country of Origin | Budgetary Price (US$)*/Qty | 詳細情報 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小 | 最大 | ||||||||||||||
| HSP031-1BM6 | 3 distributors | Free Sample Buy Direct | 量産中 | EAR99 | NEC | Tape And Reel | QFN-6L | - | - | 9 | Bi-Directional | CHINA | 0.246 / 300 | ||
（*）概算用の希望小売単価（US$）です。現地通貨でのお見積りについては、STのセールス･オフィスまたは販売代理店までお問い合わせください。
