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STPay-CPA

量産中
MySTに保存

Contact CPA SDA/DDA JavaCard platform with up to 115 kbytes of user NVM

データブリーフのダウンロード
概要
Online design
サンプル & 購入
ソリューション
ドキュメント
CADリソース
ツール & ソフトウェア
品質 & 信頼性
はじめる
Partner products
Sales Briefcase

製品概要

概要

The STPay-CPA is a GlobalPlatform® 2.2.1 Java Card™ platform for payment applications. With up to 115 Kbytes of user nonvolatile memory, the STPay-CPA is configured to support EMVCo Common Payment Application (CPA) payment applications both in Static data authentication (SDA) and Dynamic/Combined data authentication (DDA/CDA) configurations. It integrates a secure microcontroller that is based on an Arm® SecurCore® RISC core.
The STPay System-on-Chip (SoC) family is a packaged offering by ST, comprising a highly secure microcontroller, embedded application software, tools and support aimed at serving the needs of card embedders and personalization bureaus worldwide.

  • 特徴

      • Java Card™ platform
      • Up to 115 Kbytes of user nonvolatile memory
      • Certified payment application: EMVCo® Common Payment Application (CPA)
      • Common Personalization Specification (CPS) personalization
    • Platform
      • Java Card™ 2.2.2 operating system
      • GlobalPlatform® 2.2.1 MG 1.0.1 API support
      • CPS-compliant
      • ISO/IEC 7816 T = 0 contact interface
    • Hardware
      • 32-bit Arm® SecurCore® SC000™ ST31 secure microcontroller
      • Up to 115 Kbytes of user NVM
    • Cryptography
      • NESCRYPT cryptographic RSA coprocessor
      • Enhanced DES accelerator (EDES)
    • Personalization
      • EMV® CPS v1.1 compliant
    続きを読む 一部を表示

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Resource title
Latest update

製品スペック (1)

Resource title
Latest update
DB3877 ST Payment Secure Solution – Java Card™ platform with up to 115 Kbytes of user NVM for CPA SDA and DDA applications 1.0
12 Mar 2019
12 Mar 2019
DB3877 ST Payment Secure Solution – Java Card™ platform with up to 115 Kbytes of user NVM for CPA SDA and DDA applications 1.0

プレゼンテーション (2)

Resource title
Latest update
Banking & ID secure solutions 1.1
14 Aug 2020
14 Aug 2020
Banking & ID secure solutions 1.1
Biometric SoC secure solutions 1.0
14 Apr 2021
14 Apr 2021
Biometric SoC secure solutions 1.0

フライヤ (3)

Resource title
Latest update
Biometric System-on-Card: A step ahead in security and privacy 1.0
26 Nov 2020
26 Nov 2020
Biometric System-on-Card: A step ahead in security and privacy 1.0
STPay to ease & secure your payment 1.1
23 Nov 2020
23 Nov 2020
STPay to ease & secure your payment 1.1
eGovernment & eID flexible and secure solutions 2.0
23 Nov 2020
23 Nov 2020
eGovernment & eID flexible and secure solutions 2.0

パンフレット (1)

Resource title
Latest update
Secure solutions portfolio 1.1
19 Mar 2021
19 Mar 2021
Secure solutions portfolio 1.1

EDA Symbols, Footprints and 3D Models

STMicroelectronics - STPay-CPA

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

Symbols

Symbols

Footprints

Footprints

3D model

3D models

品質 & 信頼性

製品型番 Marketing Status パッケージ グレード RoHSコンプライアンスグレード 材料宣誓書**
STPAY-CPA
量産中
DICE インダストリアル N/A

STPAY-CPA

Package:

DICE

Material Declaration**:

More Info

Marketing Status

量産中

Package

DICE

Grade

Industrial

RoHS Compliance Grade

N/A

(**) st.comで提供している材料宣誓書は、パッケージ･ファミリ内で最も一般的に使用されているパッケージに基づく汎用ドキュメントの場合があります。そのため、特定の製品では100%正確ではない可能性があります。特定の製品情報については、セールスサポートまでお問い合わせください

サンプル & 購入

製品型番
販売代理店から購入
STから購入
製品ステータス
ECCN (US)
ECCN (EU)
梱包タイプ
パッケージ
温度（℃） Country of Origin
Budgetary Price (US$)*/Qty
最小
最大
STPAY-CPA

販売代理店に在庫がない場合は、STのセールス･オフィスまでお問い合わせください
量産中
3A991A2 NEC Not Applicable DICE - - FRANCE

STPAY-CPA

製品ステータス

量産中

ECCN (US)

3A991A2
詳細情報

ECCN (EU)

NEC

梱包タイプ

Not Applicable

パッケージ

DICE

Operating Temperature (°C)

(最小)

-

(最大)

-

Country of Origin

FRANCE

（*）概算用の希望小売単価（US$）です。現地通貨でのお見積りについては、STのセールス･オフィスまたは販売代理店までお問い合わせください。

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この製品をフォローして、新しいリソース、ツール、ソフトウェアの提供開始時にお知らせを受け取ることができます。手続きはわずか1分で完了します。

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- STPay-CPA

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