******************************************************************************
* @file    readme.txt
* @author  MCD Application Team
* @version 3.1
* @date    30-August-2021  
* @brief   B-L4x5x-IOT01Ax bill of material package
******************************************************************************
* COPYRIGHT(c) 2021 STMicroelectronics
*
* The Open Platform License Agreement (Agreement) is a binding legal contract
* between you ("You") and STMicroelectronics International N.V. (ST), a
* company incorporated under the laws of the Netherlands acting for the purpose
* of this Agreement through its Swiss branch 39, Chemin du Champ des Filles,
* 1228 Plan-les-Ouates, Geneva, Switzerland.
*
* By using the enclosed reference designs, schematics, PC board layouts, and
* documentation, in hardcopy or CAD tool file format (collectively, the
* Reference Material), You are agreeing to be bound by the terms and
* conditions of this Agreement. Do not use the Reference Material until You
* have read and agreed to this Agreement terms and conditions. The use of
* the Reference Material automatically implies the acceptance of the Agreement
* terms and conditions.
*
* The complete Open Platform License Agreement can be found on www.st.com/opla.
******************************************************************************

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* 1.0 - 30-March-2017
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    + Add board revision MB1297-C03.

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* 2.0 - 21-June-2017
========================
    + Add board revision MB1297-D01.

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* 3.0 - 03-April-2020
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    + Add board revision MB1297-L4S5VI-E02.

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* 3.1 - 30-August-2021
========================
    + Add board revision MB1297-L4S5VI-E03.
    + Add board revision MB1297-L475VG-915-E02.
    + Add board revision MB1297-L475VG-868-E02.

******************* (C) COPYRIGHT 2021 STMicroelectronics *****END OF FILE
