产品概述
描述
The TSV619x family of single and dual operational amplifiers offers low voltage, low power operation, and rail-to-rail input and output.
The devices also feature an ultra-low input bias current as well as a low input offset voltage.
The TSV619x have a gain bandwidth product of 450 kHz while consuming only 10 μA at 5 V. They must be used in a gain configuration (equal or above 4 or -3).
These features make the TSV619x family ideal for sensor interfaces, battery supplied and portable applications, as well as active filtering.
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所有功能
- Rail-to-rail input and output
- Low power consumption: 10 μA typ at 5 V
- Low supply voltage: 1.5 to 5.5 V
- Gain bandwidth product: 450 kHz typ
- Stable when used in gain configuration
- Low input offset voltage: 800 μV max (A version)
- Low input bias current: 1 pA typ
- Temperature range: -40 to 85 °C
eDesignSuite
eDesignSuite is a comprehensive set of easy-to-use design-aid utilities ready to help you streamline the system development process with a wide range of ST products.
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Thermal-electrical Simulators for Components
Signal Conditioning Design Tool
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Power Supply Design Tool
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AC Switches Simulator
Select ratings and application waveforms Get junction temperature and blocking voltage graphs Search and sort suitable devices 
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Help select the right ViPOWER Automotive power device Supports load-compatibility, wiring harness optimization, fault condition impact and diagnostic analysis Supports various PCB configurations 
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Specify system ratings and surge waveform Search and sort suitable devices 
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Comparators
Handles most common configurations Returns circuit components values Provides I/O signal waveforms Inverting, Non Inverting, Window 
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Input geometry and substrate properties Get antenna impedance 
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Enter forward and reverse link characteristics The tool returns link budget estimate 
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Enter antenna parameter and matching target Select the topology of the matching network The tool returns component values for the desired design targets 特别推荐
EDA符号、封装和3D模型
STMicroelectronics - TSV6192
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
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符号
封装
3D模型
质量与可靠性
| 产品型号 | Marketing Status | 封装 | 等级规格 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|---|
| TSV6192IDT | 批量生产 | SO-8 | 工业 | Ecopack3 | |
| TSV6192IST | 批量生产 | MiniSO-8 | 工业 | Ecopack3 |
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
样片和购买
| 产品型号 | Order from distributors | 从ST订购 | 供货状态 | 等级规格 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Country of Origin | Budgetary Price (US$)*/Qty | 单价(US$) | Country of Origin | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | ||||||||||||||
| TSV6192IDT | distributors 无法联系到经销商，请联系我们的销售办事处 | 批量生产 | Industrial | EAR99 | NEC | Tape and Reel | SO-8 | -40 | 85 | MOROCCO | | 0.5028 | MOROCCO | ||
| TSV6192IST | distributors 无法联系到经销商，请联系我们的销售办事处 | 批量生产 | Industrial | EAR99 | NEC | Tape and Reel | MiniSO-8 | -40 | 85 | MALAYSIA | | 0.5028 | MALAYSIA | ||