-
The TSV621 is a single operational amplifier offering low voltage, low power operation and railto- rail input and output.
With a very low input bias current and low offset voltage (800 µV maximum for the A version), the TSV621 is ideal for applications that require precision. The device can operate at a power supply ranging from 1.5 to 5.5 V, and therefore suits battery-powered devices and extends battery life.
This product features an excellent speed/power consumption ratio, offering a 420 kHz gain bandwidth while consuming only 29 µA at a 5-V supply voltage.
This operational amplifier is unity gain stable for capacitive loads up to 100 pF.
The device is internally adjusted to provide very narrow dispersion of AC and DC parameters, especially power consumption, product gain bandwidth and slew rate.
The TSV621 presents a high tolerance to ESD, sustaining 4 kV for the human body model.
Additionally, the TSV621 is offered in SC70-5 and SOT23-5 micropackages, with extended temperature ranges from -40° C to +125° C.
All these features make the TSV621 ideal for sensor interfaces, battery-supplied and portable applications, as well as active filtering.主要特性
- 4 kV HBM
- Extended temperature range: -40 to +125° C
- Micropackages: SC70-5, SOT23-5
- Unity gain stability
- Low supply voltage: 1.5 V–5.5V
- Low input offset voltage: 800 µV max (A version)
- Rail-to-rail input and output
- Gain bandwidth product: 420 kHz typ
- Low input bias current: 1 pA typ
- Low power consumption: 29 µA typ
All tools & software
All resources
产品规格 (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 12 May 2017 |
12 May 2017
|
应用手册 (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 13 Sep 2018 |
13 Sep 2018
|
技术文档 (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 19 Jul 2017 |
19 Jul 2017
|
用户手册 (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 27 Jun 2017 |
27 Jun 2017
|
Design Notes & Tips (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 13 Sep 2018 |
13 Sep 2018
|
简报 (4)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 18 Jan 2017 |
18 Jan 2017
|
|||
| 25 Mar 2020 |
25 Mar 2020
|
|||
| 18 Jan 2017 |
18 Jan 2017
|
|||
| 29 May 2015 |
29 May 2015
|
选型指南 (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 25 Oct 2016 |
25 Oct 2016
|
手册 (4)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 18 Dec 2020 |
18 Dec 2020
|
|||
| 26 Aug 2019 |
26 Aug 2019
|
|||
| 26 Nov 2020 |
26 Nov 2020
|
|||
| 19 Sep 2019 |
19 Sep 2019
|
EDA Symbols, Footprints and 3D Models
STMicroelectronics - TSV621
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
All resources
硬件型号、CAD库及SVD (2)
| Resource title | Latest update | |||
|---|---|---|---|---|
| ZIP | 14 Mar 2016 |
14 Mar 2016
|
||
| ZIP | 11 Mar 2016 |
11 Mar 2016
|
质量与可靠性
| 产品型号 | Marketing Status | 封装 | 等级规格 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|---|
| TSV621ICT |
批量生产
|
SC70-5 | 工业 | Ecopack3 | |
| TSV621ILT |
批量生产
|
SOT23-5L | 工业 | Ecopack3 |
|
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持 。
样片和购买
| 产品型号 | 从分销商订购 | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||
| TSV621ILT | 2 distributors | Free Sample Buy Direct |
批量生产
|
EAR99 | NEC | Tape And Reel | SOT23-5L | -40 | 125 | MALAYSIA | 0.3 / 1k | |
| TSV621ICT | 2 distributors | Free Sample Buy Direct |
批量生产
|
EAR99 | NEC | Tape And Reel | SC70-5 | -40 | 125 | MALAYSIA | 0.3 / 1k | |
