产品概述
描述
The TSV622, TSV622A, TSV623, TSV623A, TSV624, TSV624A, TSV625, and TSV625A dual and quad operational amplifiers offer low voltage, low power operation, and rail-to-rail input and output. The TSV62x/TSV62xA series feature an excellent speed/power consumption ratio, offering a 420 kHz gain bandwidth product while consuming only 29 μA at 5 V supply voltage.These op-amps are unity gain stable for capacitive loads up to 100 pF. They also feature an ultra-low input bias current and low input offset voltage. TSV623 (dual) and TSV625 (quad) have two shutdown pins to reduce power consumption.
These features make the TSV62x/TSV62xA family ideal for sensor interfaces, battery-supplied and portable applications, and active filtering.
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所有功能
- Rail-to-rail input and output
- Low power consumption: 29 μA typ, 36 μA max
- Low supply voltage: 1.5 – 5.5 V
- Gain bandwidth product: 420 kHz typ
- Unity gain stable on 100 pF capacitor
- Low power shutdown mode: 5 nA typ
- Good accuracy: 800 μV max (A version)
- Low input bias current: 1 pA typ
- EMI hardened operational amplifiers
All tools & software
全部资源
| Resource title | 版本 | Latest update |
|---|
产品规格 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 6.0 | 30 May 2017 | 30 May 2017 |
应用手册 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.1 | 13 Sep 2018 | 13 Sep 2018 |
技术文档 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.0 | 19 Jul 2017 | 19 Jul 2017 |
用户手册 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.0 | 27 Jun 2017 | 27 Jun 2017 |
Design Notes & Tips (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.0 | 13 Sep 2018 | 13 Sep 2018 |
简报 (4)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 18 Jan 2017 | 18 Jan 2017 | |||
| 11.2017 | 23 Mar 2021 | 23 Mar 2021 | ||
| 3.0 | 18 Jan 2017 | 18 Jan 2017 | ||
| 29 May 2015 | 29 May 2015 |
选型指南 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.0 | 25 Oct 2016 | 25 Oct 2016 |
手册 (4)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.0 | 19 Mar 2021 | 19 Mar 2021 | ||
| 1.0 | 14 Apr 2021 | 14 Apr 2021 | ||
| 3.0 | 30 Apr 2021 | 30 Apr 2021 | ||
| 1.0 | 19 Sep 2019 | 19 Sep 2019 |
EDA符号、封装和3D模型
STMicroelectronics - TSV624
为您的应用下载所有EDA符号、封装和3D模型，加快您的设计速度。您可以从大量CAD格式中进行选择，以匹配您的设计工具链。
符号
封装
3D模型
全部资源
| Resource title | 版本 | Latest update |
|---|
HW Models (2)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| ZIP | 3.1 | 14 Mar 2016 | 14 Mar 2016 | |
| ZIP | 2.1 | 11 Mar 2016 | 11 Mar 2016 |
样片和购买
| 产品型号 | 从分销商订购 | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||
| TSV624IPT | 3 distributors | Buy Direct | 批量生产 | EAR99 | NEC | Tape And Reel | TSSOP-14L | -40 | 125 | MOROCCO | 0.6 / 1k | |
