Product overview
描述
The TSV6292, TSV6293, TSV6294 and TSV6295 dual and quad operational amplifiers offer a high bandwidth of 1.3 MHz while consuming only 29 μA. They must be used in a gain configuration (equal or above +4 or -3). The TSV629x series features low voltage, low power operation and rail-to-rail input and output.The devices also offer an ultra-low input bias current and low input offset voltage.
The TSV6293 (dual) and TSV6295 (quad) have two shutdown pins for reduced power consumption.
These features make the TSV629x family ideal for sensor interfaces, battery supplied and portable applications, as well as active filtering.
-
All features
- EMI hardened operational amplifiers
- Micropackages: MiniSO-8, SOT23-8, MiniSO-10, TSSOP14, TSSOP16
- Extended temperature range: -40 to +125° C
- High tolerance to ESD: 4 kV HBM
- Good accuracy: 800 μV max (A version)
- Low power shutdown mode: 5 nA typ
- Rail-to-rail input and output
- Low supply voltage: 1.5 5.5 V
- Low power consumption: 29 μA typ, 36 μA max
- Stable when used in gain configuration
- Low input bias current: 1 pA typ
- High gain bandwidth product: 1.3 MHz typ
精选 视频
All tools & software
All resources
Resource title | Latest update |
---|
产品规格 (1)
Resource title | Latest update | |||
---|---|---|---|---|
19 Sep 2016 |
19 Sep 2016
|
技术文档 (1)
Resource title | Latest update | |||
---|---|---|---|---|
19 Jul 2017 |
19 Jul 2017
|
用户手册 (1)
Resource title | Latest update | |||
---|---|---|---|---|
27 Jun 2017 |
27 Jun 2017
|
Design Notes & Tips (1)
Resource title | Latest update | |||
---|---|---|---|---|
13 Sep 2018 |
13 Sep 2018
|
简报 (4)
Resource title | Latest update | |||
---|---|---|---|---|
18 Jan 2017 |
18 Jan 2017
|
|||
25 Mar 2020 |
25 Mar 2020
|
|||
18 Jan 2017 |
18 Jan 2017
|
|||
29 May 2015 |
29 May 2015
|
选型指南 (1)
Resource title | Latest update | |||
---|---|---|---|---|
25 Oct 2016 |
25 Oct 2016
|
手册 (4)
Resource title | Latest update | |||
---|---|---|---|---|
18 Dec 2020 |
18 Dec 2020
|
|||
26 Aug 2019 |
26 Aug 2019
|
|||
26 Nov 2020 |
26 Nov 2020
|
|||
19 Sep 2019 |
19 Sep 2019
|
EDA Symbols, Footprints and 3D Models
质量与可靠性
产品型号 | Marketing Status | 封装 | 等级规格 | 符合RoHS级别 | 材料声明** |
---|---|---|---|---|---|
TSV6293IST |
批量生产
|
TSSOP-10L | 工业 | Ecopack3 |
|
TSV6293IST
Package:
TSSOP-10LMaterial Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持 。
样片和购买
产品型号 | 从分销商订购 | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度(ºC) | Country of Origin | Budgetary Price (US$)*/Qty | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|
最小值 | 最大值 | |||||||||||
TSV6293IST | 无法联系到经销商,请联系我们的销售办事处 |
批量生产
|
EAR99 | NEC | Tape And Reel | TSSOP-10L | -40 | 125 | MALAYSIA | 0.51 / 1k |
供货状态
批量生产ECCN (US)
EAR99Budgetary Price (US$)*/Qty
0.51 / 1k