产品概述
描述
The TSV6390, TSV6391, and their "A" versions are single operational amplifiers (op amps) offering low voltage, low power operation, and rail-to-rail input and output.
With a very low input bias current and low offset voltage (500 µV maximum for the A version), the TSV6390 and TSV6391 are ideal for applications requiring precision. The devices can operate at power supplies ranging from 1.5 to 5.5 V, and are therefore ideal for battery-powered devices, extending battery life.
When used with a gain (above -3 or 4), these products feature an excellent speed/power consumption ratio, offering a 2.4 MHz gain bandwidth product while consuming only 60 µA at a 5 V supply voltage.
The TSV6390 comes with a shutdown function.
Both the TSV6390 and TSV6391 have a high tolerance to ESD, sustaining 4 kV for the human body model.
They are offered in micropackages, SC70-6 and SOT23-6 for the TSV6390 and SC70-5 and SOT23-5 for the TSV6391. They are guaranteed for industrial temperature ranges from -40 °C to 125 °C.
All these features combined make the TSV6390 and TSV6391 ideal for sensor interfaces, battery-supplied, and portable applications, as well as active filtering.
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所有功能
- Low offset voltage: 500 µV max (A version)
- Low power consumption: 60 µA typ at 5 V
- Low supply voltage: 1.5 V – 5.5 V
- Gain bandwidth product: 2.4 MHz typical
- Stable in gain configuration (-3 or 4)
- Low power shutdown mode: 5 nA typical
- High output current: 63 mA at VCC = 5 V
- Low input bias current: 1 pA typical
- Rail-to-rail input and output
- Extended temperature range: -40 °C to 125 °C
- 4 kV human body model
eDesignSuite
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Power Management Design Center
Thermal-electrical Simulators for Components
Signal Conditioning Design Tool
NFC/RFID Calculators
Power Supply Design Tool
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LED Lighting Design Tool
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Power Tree Designer
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AC Switches Simulator
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Rectifier Diodes Simulator
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Help select the right ViPOWER Automotive power device Supports load-compatibility, wiring harness optimization, fault condition impact and diagnostic analysis Supports various PCB configurations 
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Specify system ratings and surge waveform Search and sort suitable devices 
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Comparators
Handles most common configurations Returns circuit components values Provides I/O signal waveforms Inverting, Non Inverting, Window 
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Enter antenna parameter and matching target Select the topology of the matching network The tool returns component values for the desired design targets 特别推荐
EDA符号、封装和3D模型
STMicroelectronics - TSV6390
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Please select one model supplier :
符号
封装
3D模型
全部资源
| 资源标题 | 版本 | 更新时间 |
|---|
HW Models (1)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| ZIP | 3.1 | 01 Aug 2015 | 01 Aug 2015 |
质量与可靠性
| 产品型号 | Marketing Status | 封装 | 等级规格 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|---|
| TSV6390ICT | 批量生产 | SC70-6 | 工业 | Ecopack3 | |
| TSV6390ILT | 批量生产 | SOT23-6L | 工业 | Ecopack3 | |
TSV6390ICT
Package:
SC70-6Material Declaration**:
TSV6390ILT
Package:
SOT23-6LMaterial Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
样片和购买
| 产品型号 | Order from distributors | 从ST订购 | 供货状态 | 等级规格 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Country of Origin | Budgetary Price (US$)*/Qty | 单价(US$) | Country of Origin | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | ||||||||||||||
| TSV6390ICT | distributors 无法联系到经销商，请联系我们的销售办事处 | 批量生产 | Industrial | EAR99 | NEC | Tape and Reel | SC70-6 | -40 | 125 | MALAYSIA | | 0.4266 | MALAYSIA | ||
| TSV6390ILT | distributors 无法联系到经销商，请联系我们的销售办事处 | 批量生产 | Industrial | EAR99 | NEC | Tape and Reel | SOT23-6L | -40 | 125 | MALAYSIA | | 0.4266 | MALAYSIA | ||