产品概述
描述
The TSV73x series of single, dual, and quad operational amplifiers offer low-voltage operation, rail-to-rail input and output, and excellent accuracy (Violower than 200 μV at 25 °C). These devices benefit from STMicroelectronics®5 V CMOS technology and offer an excellent speed/power consumption ratio (900 kHz typical gain bandwidth) while consuming 60 μA typical at 5 V. The TSV73x series also feature an ultra-low input bias current.The single version (TSV731), the dual version (TSV732), and the quad version (TSV734) are housed in the smallest industrial packages.
These characteristics make the TSV73x family ideal for sensor interfaces, battery-powered and portable applications, and active filtering.
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所有功能
- Low offset voltage: 200 μV max.
- Low power consumption: 60 μA at 5 V
- Low supply voltage: 1.5 V to 5.5 V
- Gain bandwidth product: 900 kHz typ.
- Low input bias current: 1 pA typ.
- Rail-to-rail input and output
- EMI hardened operational amplifiers
- High tolerance to ESD: 4 kV HBM
- Extended temperature range: -40 to +125 °C
- Benefits
- Higher accuracy without calibration
- Energy saving
- Guaranteed operation on low-voltage battery
- Related products
- See the TSV71 series (150 kHz for 14 μA) for more power savings
All tools & software
All resources
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产品规格 (1)
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| 19 Sep 2016 | 19 Sep 2016 |
应用手册 (2)
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| 13 Sep 2018 | 13 Sep 2018 | |||
| 10 Nov 2014 | 10 Nov 2014 |
技术文档 (2)
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| 19 Jul 2017 | 19 Jul 2017 | |||
| 07 Oct 2016 | 07 Oct 2016 |
用户手册 (1)
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| 27 Jun 2017 | 27 Jun 2017 |
Design Notes & Tips (1)
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| 13 Sep 2018 | 13 Sep 2018 |
简报 (4)
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| 18 Jan 2017 | 18 Jan 2017 | |||
| 23 Mar 2021 | 23 Mar 2021 | |||
| 18 Jan 2017 | 18 Jan 2017 | |||
| 29 May 2015 | 29 May 2015 |
宣传册 (1)
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| 15 Jun 2018 | 15 Jun 2018 |
选型指南 (1)
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| 25 Oct 2016 | 25 Oct 2016 |
手册 (3)
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| 19 Mar 2021 | 19 Mar 2021 | |||
| 14 Apr 2021 | 14 Apr 2021 | |||
| 30 Apr 2021 | 30 Apr 2021 |
EDA Symbols, Footprints and 3D Models
STMicroelectronics - TSV731
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
All resources
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SPICE models (1)
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| ZIP | 11 Dec 2020 | 11 Dec 2020 |
质量与可靠性
| 产品型号 | Marketing Status | 封装 | 等级规格 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|---|
| TSV731ICT | 批量生产 | SC70-5 | 工业 | Ecopack3 | |
TSV731ICT
Package:
SC70-5Material Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持 。
