产品概述
描述
The TSV73x series of single, dual, and quad operational amplifiers offer low-voltage operation, rail-to-rail input and output, and excellent accuracy (Violower than 200 μV at 25 °C).
These devices benefit from STMicroelectronics®5 V CMOS technology and offer an excellent speed/power consumption ratio (900 kHz typical gain bandwidth) while consuming 60 μA typical at 5 V. The TSV73x series also feature an ultra-low input bias current.
The single version (TSV731), the dual version (TSV732), and the quad version (TSV734) are housed in the smallest industrial packages.
These characteristics make the TSV73x family ideal for sensor interfaces, battery-powered and portable applications, and active filtering.
-
所有功能
- Low offset voltage: 200 μV max.
- Low power consumption: 60 μA at 5 V
- Low supply voltage: 1.5 V to 5.5 V
- Gain bandwidth product: 900 kHz typ.
- Low input bias current: 1 pA typ.
- Rail-to-rail input and output
- EMI hardened operational amplifiers
- High tolerance to ESD: 4 kV HBM
- Extended temperature range: -40 to +125 °C
- Benefits
- Higher accuracy without calibration
- Energy saving
- Guaranteed operation on low-voltage battery
- Related products
- See the TSV71 series (150 kHz for 14 μA) for more power savings
eDesignSuite
eDesignSuite is a comprehensive set of easy-to-use design-aid utilities ready to help you streamline the system development process with a wide range of ST products.
Power Management Design Center
Thermal-electrical Simulators for Components
Signal Conditioning Design Tool
NFC/RFID Calculators
Power Supply Design Tool
SMPS design, by topology, by type and by product PFC design with analog and digitial control Supports various PCB configurations 
LED Lighting Design Tool
Handles AC-DC and DC-DC design in common topologies Displays interactive and annotated schematic Provides current/voltage graphs, Bode plots, efficiency curves and power-loss data 
Digital Power Workbench
Provides a step-by-step optimized design of power section and control loop Generates the STM32Cube embedded software package for custom applications and allows firmware project generation, compatible with multiple STM32 IDEs 
Power Tree Designer
Specify input/output power for each node in the tree Check for consistency Design each individual node 
AC Switches Simulator
Select ratings and application waveforms Get junction temperature and blocking voltage graphs Search and sort suitable devices 
Rectifier Diodes Simulator
Select ratings and application waveforms Estimate power losses Search and sort suitable devices 
STPOWER Studio
Supports long mission profiles Provides power loss and temperature graphs Helps define heatsink thermal properties 
Twister Sim
Help select the right ViPOWER Automotive power device Supports load-compatibility, wiring harness optimization, fault condition impact and diagnostic analysis Supports various PCB configurations 
TVS Simulator
Specify system ratings and surge waveform Search and sort suitable devices 
Active Filters
Handles multi-stage-designs and common topologies Returns circuit component values Provides gain, phase and group delay graphs Low Pass, High Pass and Band Pass 
Comparators
Handles most common configurations Returns circuit components values Provides I/O signal waveforms Inverting, Non Inverting, Window 
Low side Current Sensing
Returns circuit component values Provides current error graphs 
High side Current Sensing
Provides current error graphs. Help to select the right High side current sensing and shunt devices. 
NFC Inductance
Input geometry and substrate properties Get antenna impedance 
UHF Link Budget
Enter forward and reverse link characteristics The tool returns link budget estimate 
NFC Tuning Circuit
Enter antenna parameter and matching target Select the topology of the matching network The tool returns component values for the desired design targets 特别推荐
EDA符号、封装和3D模型
STMicroelectronics - TSV731
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Please select one model supplier :
符号
封装
3D模型
全部资源
| 资源标题 | 版本 | 更新时间 |
|---|
SPICE models (1)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| ZIP | 1.0 | 01 Aug 2015 | 01 Aug 2015 |
质量与可靠性
| 产品型号 | Marketing Status | 封装 | 等级规格 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|---|
| TSV731ICT | 批量生产 | SC70-5 | 工业 | Ecopack3 | |
TSV731ICT
Package:
SC70-5Material Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
样片和购买
| 产品型号 | Order from distributors | 从ST订购 | 供货状态 | 等级规格 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Country of Origin | Budgetary Price (US$)*/Qty | 单价(US$) | Country of Origin | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | ||||||||||||||
| TSV731ICT | distributors 无法联系到经销商，请联系我们的销售办事处 | 批量生产 | Industrial | EAR99 | NEC | Tape and Reel | SC70-5 | -40 | 125 | MALAYSIA | | 0.3732 | MALAYSIA | ||