产品概述
描述
The TSV73x series of single, dual, and quad operational amplifiers offer low-voltage operation, rail-to-rail input and output, and excellent accuracy (Violower than 200 μV at 25 °C). These devices benefit from STMicroelectronics®5 V CMOS technology and offer an excellent speed/power consumption ratio (900 kHz typical gain bandwidth) while consuming 60 μA typical at 5 V. The TSV73x series also feature an ultra-low input bias current.The single version (TSV731), the dual version (TSV732), and the quad version (TSV734) are housed in the smallest industrial packages.
These characteristics make the TSV73x family ideal for sensor interfaces, battery-powered and portable applications, and active filtering.
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所有功能
- Low offset voltage: 200 μV max.
- Low power consumption: 60 μA at 5 V
- Low supply voltage: 1.5 V to 5.5 V
- Gain bandwidth product: 900 kHz typ.
- Low input bias current: 1 pA typ.
- Rail-to-rail input and output
- EMI hardened operational amplifiers
- High tolerance to ESD: 4 kV HBM
- Extended temperature range: -40 to +125 °C
- Benefits
- Higher accuracy without calibration
- Energy saving
- Guaranteed operation on low-voltage battery
- Related products
- See the TSV71 series (150 kHz for 14 μA) for more power savings
All tools & software
全部资源
| Resource title | 版本 | Latest update |
|---|
产品规格 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 2.0 | 19 Sep 2016 | 19 Sep 2016 |
应用手册 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 2.0 | 13 Sep 2018 | 13 Sep 2018 |
技术文档 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.0 | 19 Jul 2017 | 19 Jul 2017 |
用户手册 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.0 | 27 Jun 2017 | 27 Jun 2017 |
Design Notes & Tips (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.0 | 13 Sep 2018 | 13 Sep 2018 |
简报 (4)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 18 Jan 2017 | 18 Jan 2017 | |||
| 11.2017 | 23 Mar 2021 | 23 Mar 2021 | ||
| 3.0 | 18 Jan 2017 | 18 Jan 2017 | ||
| 29 May 2015 | 29 May 2015 |
选型指南 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.0 | 25 Oct 2016 | 25 Oct 2016 |
手册 (3)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.0 | 19 Mar 2021 | 19 Mar 2021 | ||
| 1.0 | 14 Apr 2021 | 14 Apr 2021 | ||
| 3.0 | 30 Apr 2021 | 30 Apr 2021 |
EDA符号、封装和3D模型
STMicroelectronics - TSV732
为您的应用下载所有EDA符号、封装和3D模型，加快您的设计速度。您可以从大量CAD格式中进行选择，以匹配您的设计工具链。
符号
封装
3D模型
全部资源
| Resource title | 版本 | Latest update |
|---|
SPICE models (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| ZIP | 1.0 | 11 Dec 2020 | 11 Dec 2020 |
质量与可靠性
| 产品型号 | Marketing Status | 封装 | 等级规格 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|---|
| TSV732IQ2T | 批量生产 | DFN-8L P 0.5 mm | 工业 | Ecopack3 | |
| TSV732IST | 批量生产 | MiniSO-8 | 工业 | Ecopack3 |
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持 。
样片和购买
| 产品型号 | 从分销商订购 | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||
| TSV732IQ2T | 1 distributors | Free Sample Buy Direct | 批量生产 | EAR99 | NEC | Tape And Reel | DFN-8L P 0.5 mm | -40 | 125 | CHINA | 0.4961 / 1k | |
| TSV732IST | 1 distributors | Free Sample Buy Direct | 批量生产 | EAR99 | NEC | Tape And Reel | MiniSO-8 | -40 | 125 | MALAYSIA | 0.4961 / 1k | |
