产品概述
描述
The TSV912H operational amplifier offers low voltage operation and rail-to-rail input and output. The device features an excellent speed/power consumption ratio, offering an 8 MHz gain-bandwidth product while consuming only 1.1 mA maximum at 5 V. It is unity gain stable and features an ultra-low input bias current.The TSV912H is a high temperature version of the TSV912, and can operate from -40 °C to 150 °C with unique characteristics. Its main target applications are automotive, but the device is also ideal for sensor interfaces, battery-supplied and portable applications, as well as active filtering.
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所有功能
- Rail-to-rail input and output
- Wide bandwidth
- Low power consumption: 820 µA typ
- Unity gain stability
- High output current: 35 mA
- Operating range from 2.5 to 5.5 V
- Low input bias current, 1 pA typ
- ESD internal protection ≥ 5 kV
- Latch-up immunity
All tools & software
全部资源
| Resource title | 版本 | Latest update |
|---|
产品规格 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 2.0 | 02 Mar 2016 | 02 Mar 2016 |
应用手册 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.6 | 19 Mar 2021 | 19 Mar 2021 |
技术文档 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.0 | 19 Jul 2017 | 19 Jul 2017 |
用户手册 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.0 | 27 Jun 2017 | 27 Jun 2017 |
Design Notes & Tips (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.0 | 13 Sep 2018 | 13 Sep 2018 |
简报 (4)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 18 Jan 2017 | 18 Jan 2017 | |||
| 11.2017 | 23 Mar 2021 | 23 Mar 2021 | ||
| 3.0 | 18 Jan 2017 | 18 Jan 2017 | ||
| 29 May 2015 | 29 May 2015 |
选型指南 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.0 | 25 Oct 2016 | 25 Oct 2016 |
手册 (4)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.0 | 19 Mar 2021 | 19 Mar 2021 | ||
| 1.0 | 02 Feb 2021 | 02 Feb 2021 | ||
| 1.0 | 14 Apr 2021 | 14 Apr 2021 | ||
| 3.0 | 30 Apr 2021 | 30 Apr 2021 |
EDA符号、封装和3D模型
STMicroelectronics - TSV912H
为您的应用下载所有EDA符号、封装和3D模型，加快您的设计速度。您可以从大量CAD格式中进行选择，以匹配您的设计工具链。
符号
封装
3D模型
全部资源
| Resource title | 版本 | Latest update |
|---|
HW Models (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| ZIP | 2.1 | 14 Mar 2016 | 14 Mar 2016 |
样片和购买
| 产品型号 | 从分销商订购 | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||
| TSV912HYDT | 4 distributors | Free Sample Buy Direct | 批量生产 | EAR99 | NEC | Tape And Reel | SO-8 | -40 | 150 | MOROCCO | 0.517 / 1k | |
