A22H165

批量生产

高性能G类立体声耳机放大器

下载数据手册 Order Direct
概述
Online design
样片和购买
解决方案
文件
CAD资源
工具与软件
质量与可靠性
Partner products
Sales Briefcase

产品概述

描述

The A22H165 is a class-G stereo headphone driver dedicated to high-performance audio, high power efficiency and space-constrained applications. It is based on the core technology of a low power dissipation amplifier combined with a high efficiency step-down DC-DC converter for supplying this amplifier. When powered by a battery, the internal step down DC-DC converter generates the appropriate voltage to the amplifier depending on the amplitude of the audio signal to supply the headsets. It achieves a total 2.1 mA current consumption at 100 μW output power (10 dB crest factor). THD+N is 0.02 % maximum at 1 kHz and PSRR is 100 dB at 217 Hz, which ensures a high audio quality of the device in a wide range of environments. The traditionally bulky output coupling capacitors can be removed. A dedicated common-mode sense pin removes parasitic ground noise. The A22H165 is designed to be used with an output serial resistor. It ensures unconditional stability over a wide range of capacitive loads. The A22H165 is packaged in a tiny 16-bump flip-chip package with a pitch of 400 μm.
  • 所有功能

    • Power supply range: 2.3 V to 4.8 V
    • 0.6 mA/channel quiescent current
    • 2.1 mA current consumption with 100 μW/channel (10 dB crest factor)
    • 0.006% typical THD+N at 1 kHz
    • 100 dB typical PSRR at 217 Hz
    • 100 dB of SNR A-weighted at G = 0 dB
    • Zero "pop and click"
    • Gain settings: 0 dB and 6 dB
    • Integrated high efficiency step-down converter
    • Low standby current: 5 μA max
    • Output-coupling capacitors removed
    • Thermal shutdown
    • Flip-chip package: 1.65 mm x 1.65 mm, 400 μm pitch, 16 bumps

特别推荐

EDA符号、封装和3D模型

STMicroelectronics - A22H165

为您的应用下载所有EDA符号、封装和3D模型,加快您的设计速度。您可以从大量CAD格式中进行选择,以匹配您的设计工具链。

Symbols

符号

Footprints

封装

3D model

3D模型

质量与可靠性

产品型号 Marketing Status 封装 等级规格 符合RoHS级别 材料声明**
A22H165J
批量生产
CSP P 0.4 mm 工业 Ecopack3

A22H165J

Package:

CSP P 0.4 mm

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

CSP P 0.4 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack3

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

产品型号
从分销商订购
从ST订购
供货状态
ECCN (US)
ECCN (EU)
包装类型
封装
温度(ºC) Country of Origin
Budgetary Price (US$)*/Qty
最小值
最大值
A22H165J 无法联系到经销商,请联系我们的销售办事处 Buy Direct
批量生产
EAR99 NEC Tape And Reel CSP P 0.4 mm -40 85 FRANCE 0.3275 / 1k

A22H165J

供货状态

批量生产

ECCN (US)

EAR99

Budgetary Price (US$)*/Qty

0.3275 / 1k

ECCN (EU)

NEC

包装类型

Tape And Reel

封装

CSP P 0.4 mm

Operating Temperature (°C)

(最小值)

-40

(最大值)

85

Budgetary Price (US$)* / Qty

0.3275 / 1k

Country of Origin

FRANCE

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商