A22H165M

批量生产
Design Win

高性能G类立体声耳机放大器,带I2C音量控制

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概述
样片和购买
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文件
CAD资源
工具与软件
质量与可靠性
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Sales Briefcase

产品概述

描述

The A22H165M is a class-G stereo headphone driver dedicated to high audio performance, high power efficiency and space-constrained applications such as wearable and fitness.

It is based on the core technology of a low power dissipation amplifier combined with a high efficiency buck converter for supplying this amplifier.

When powered by a battery, the buck converter generates the appropriate voltage to the amplifier depending on the amplitude of the audio signal to supply the headsets. It achieves a total 2.1 mA current consumption at 100 μW output power (10 dB crest factor).

THD+N is 0.02% maximum at 1 kHz and PSRR is 100 dB at 217 Hz, which ensures a high audio quality of the device in a wide range of environments.

The traditionally bulky output coupling capacitors can be removed.

A dedicated common-mode sense pin removes parasitic ground noise.

The A22H165M is designed to be used with an output serial resistor. It ensures unconditional stability over a wide range of capacitive loads. The A22H165M is packaged in a tiny 16-bump flip-chip package with a pitch of 400 μm.

  • 所有功能

    • Power supply range: 2.3 V to 4.8 V
    • 0.6 mA/channel quiescent current
    • 2.1 mA current consumption with 100 μW/channel (10 dB crest factor)
    • 0.006% typical THD+N at 1 kHz
    • 100 dB typical PSRR at 217 Hz
    • 100 dB of SNR A-weighted at G = 0 dB
    • Zero pop and click
    • I²C interface for volume control
    • Digital volume control range from -60 dB to +4 dB
    • Independent right and left channel shutdown control
    • Integrated high-efficiency buck converter
    • Low software standby current: 5 μA max
    • Output coupling capacitors removed
    • Thermal shutdown and short-circuit protection
    • Flip-chip package: 1.65 mm x 1.65 mm, 400 μm pitch, 16 bumps

EDA符号、封装和3D模型

STMicroelectronics - A22H165M

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符号

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封装

3D model

3D模型

质量与可靠性

产品型号 Marketing Status 封装 等级规格 符合RoHS级别 材料声明**
A22H165MJ
批量生产
CSP P 0.4 mm 工业 Ecopack3

A22H165MJ

Package:

CSP P 0.4 mm

Material Declaration**:

Marketing Status

批量生产

Package

CSP P 0.4 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack3

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

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产品型号
Order from distributors
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供货状态
ECCN (US)
ECCN (EU)
包装类型
封装
温度(ºC) Country of Origin
Budgetary Price (US$)*/Qty
最小值
最大值
A22H165MJ Available at distributors

经销商的可用性 A22H165MJ

代理商名称
地区 库存 最小订购量 第三方链接

代理商库存报告日期:

无法联系到经销商,请联系我们的销售办事处
批量生产
EAR99 NEC Tape and Reel CSP P 0.4 mm -40 85 CHINA

A22H165MJ 批量生产

封装:
CSP P 0.4 mm
ECCN (US):
EAR99
Budgetary Price (US$)*/Qty:
-

产品型号:

A22H165MJ

ECCN (EU):

NEC

包装类型:

Tape and Reel

Operating Temperature (°C)

Min:

-40

Max:

85

Country of Origin:

CHINA

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(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商