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  • The A22H165M is a class-G stereo headphone driver dedicated to high audio performance, high power efficiency and space-constrained applications such as wearable and fitness.

    It is based on the core technology of a low power dissipation amplifier combined with a high efficiency buck converter for supplying this amplifier.
    When powered by a battery, the buck converter generates the appropriate voltage to the amplifier depending on the amplitude of the audio signal to supply the headsets. It achieves a total 2.1 mA current consumption at 100 μW output power (10 dB crest factor).
    THD+N is 0.02% maximum at 1 kHz and PSRR is 100 dB at 217 Hz, which ensures a high audio quality of the device in a wide range of environments.
    The traditionally bulky output coupling capacitors can be removed.
    A dedicated common-mode sense pin removes parasitic ground noise.
    The A22H165M is designed to be used with an output serial resistor. It ensures unconditional stability over a wide range of capacitive loads. The A22H165M is packaged in a tiny 16-bump flip-chip package with a pitch of 400 μm.

    主要特性

    • Power supply range: 2.3 V to 4.8 V
    • 0.6 mA/channel quiescent current
    • 2.1 mA current consumption with 100 μW/channel (10 dB crest factor)
    • 0.006% typical THD+N at 1 kHz
    • 100 dB typical PSRR at 217 Hz
    • 100 dB of SNR A-weighted at G = 0 dB
    • Zero pop and click
    • I²C interface for volume control
    • Digital volume control range from -60 dB to +4 dB
    • Independent right and left channel shutdown control
    • Integrated high-efficiency buck converter
    • Low software standby current: 5 μA max
    • Output coupling capacitors removed
    • Thermal shutdown and short-circuit protection
    • Flip-chip package: 1.65 mm x 1.65 mm, 400 μm pitch, 16 bumps

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CAD/EDA Symbols, Footprints and Models

质量与可靠性

产品型号 Marketing Status 封装 等级规格 符合RoHS级别 材料声明**
A22H165MJ
批量生产
Chip Scale Package 0.4mm pitch 工业 Ecopack3

A22H165MJ

Package:

Chip Scale Package 0.4mm pitch

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

Chip Scale Package 0.4mm pitch

Grade

Industrial

RoHS Compliance Grade

Ecopack3

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

产品型号
从分销商订购
从ST订购
供货状态
ECCN (US)
ECCN (EU)
包装类型
封装
温度(ºC) Country of Origin
Budgetary Price (US$)*/Qty
最小值
最大值
A22H165MJ Available at 1 distributors

...的经销商可用性A22H165MJ

代理商名称
地区 库存 最小订购量 第三方链接
Farnell Element14 EUROPE 5000 1 马上订购

代理商库存报告日期: 2020-10-26

代理商名称

Farnell Element14

库存

5000

Min.Order

1

地区

EUROPE 马上订购

代理商库存报告日期: 2020-10-26

Free Sample Buy Direct
批量生产
EAR99 NEC Tape And Reel Chip Scale Package 0.4mm pitch -40 85 CHINA 0.5 / 1k

A22H165MJ

供货状态

批量生产

ECCN (US)

EAR99

Budgetary Price (US$)*/Qty

0.5 / 1k

...的经销商可用性A22H165MJ

代理商名称
地区 库存 最小订购量 第三方链接
Farnell Element14 EUROPE 5000 1 马上订购

代理商库存报告日期: 2020-10-26

代理商名称

Farnell Element14

库存

5000

Min.Order

1

地区

EUROPE 马上订购

代理商库存报告日期: 2020-10-26

ECCN (EU)

NEC

包装类型

Tape And Reel

封装

Chip Scale Package 0.4mm pitch

Operating Temperature (°C)

(最小值)

-40

(最大值)

85

Budgetary Price (US$)* / Qty

0.5 / 1k

Country of Origin

CHINA

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商